Electronics Forum: universal instruments gsm1&2 (Page 21 of 22)

Pick and Place vs CAD File

Electronics Forum | Mon Sep 25 08:24:25 EDT 2017 | directx995

At the moment we do it like this: We get .csv or .txt pick and place file and .csv or excel bom file. Then I verify every single placement manualy with BOM and delete placements that are not listed on BOM. (Yes, you are right, I do it for 30 placeme

Re: Assembly of CSP on pads with vias.

Electronics Forum | Sat Jan 23 13:29:40 EST 1999 | Earl Moon

| Hi Everyone, | We plan to build, for reliability/experimental/research purpose some CSPs (namely Tessera microBGA 46-I/O 0/75mm pitch and TI 64 I/O 0/8 mm pitch). the various factors that we plan to evaluate are the reliability and assembly concern

Re: Assembly of CSP on pads with vias.

Electronics Forum | Sat Jan 23 17:00:44 EST 1999 | Earl Moon

| | Hi Everyone, | | We plan to build, for reliability/experimental/research purpose some CSPs (namely Tessera microBGA 46-I/O 0/75mm pitch and TI 64 I/O 0/8 mm pitch). the various factors that we plan to evaluate are the reliability and assembly con

SOD323 and SC90 bounceing parts in final PNP stages.

Electronics Forum | Sun Mar 04 01:56:37 EST 2012 | eadthem

What we have had recently is a lot of larger thin (32 thou) thickness boards that have had issues with SC90 diodes bouncing off the pads in the final PNP machine. Our setup, universal instruments GC120 or quad beam 30 spindle lightning heads. This m

Universal Instruments Radial Inserter

Electronics Forum | Mon Jul 30 15:28:25 EDT 2007 | gmoritz

I'm posting a diary of the major repair experience that we had this weekend. I'll follow up with a shorter post that sort of summarizes a few things. ------------------------------------------------ The service guys showed up at our facility about

Iscan 3D Measurement

Electronics Forum | Wed Oct 09 08:36:44 EDT 2002 | pjc

Operation features of many devices, machine components, instruments depend substantially on state of their surfaces. Selective surface processing by high-intensity energy beam (ion, electron, laser treatment) is one of the most perspective directions

Re: PCB Warping.

Electronics Forum | Wed Mar 18 09:03:57 EST 1998 | Earl Moon

| Problem occurs because the glass transition temp for FR4 is lower than reflow temperature. Our company wrote an article which was printed in SMT magazine some years ago | that deals with this exact subject. Best way to deal with this is to use a ce

Universal Instruments Radial Inserter

Electronics Forum | Mon Jul 30 16:21:33 EDT 2007 | gmoritz

I'll respond to this one since it is the most poignant post in this thread: ------------------------------------------------------ Most of what follows is common sense, but sometimes we need to get grounded to remember these common sense things. ---

Optimal Speed for Universal Chip Shooters

Electronics Forum | Wed Jun 11 16:30:33 EDT 2003 | T.Vick

You have received some great feedback so far. I would like to summarize and add a few points regarding maintenance. You should start (as recommended already) by verifying your component library data. Using the default values from the master library i

Re: IPC and Nepcon

Electronics Forum | Wed Nov 18 14:42:22 EST 1998 | Dave F

| I heard somewhere that SMEMA has joined IPC, and that the association has decided to boycott Nepcon from | year 2000. Can anyone tell me if this is true | Nick: SMEMA and IPC are talking about merging (EP&P, 11/98, p 18). Below is a news release


universal instruments gsm1&2 searches for Companies, Equipment, Machines, Suppliers & Information

PCB Handling with CE

Training online, at your facility, or at one of our worldwide training centers"
SMT spare parts - Qinyi Electronics

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...
Voidless Reflow Soldering

Component Placement 101 Training Course
Win Source Online Electronic parts

Software for SMT placement & AOI - Free Download.
SMT spare parts

Low-cost, self-paced, online training on electronics manufacturing fundamentals