Electronics Forum: up (Page 136 of 1184)

Re: Single profile?

Electronics Forum | Thu Jan 27 20:36:13 EST 2000 | Dave F

HJ: Your best chance of running your boards with a single profile is with ovens from the established suppliers (ie, BTU, Conceptronics, Heller, Vitronics, etc). They are experienced in robust control system designs. Stepping aside from that, consi

BGA voids

Electronics Forum | Mon Jan 17 13:09:12 EST 2000 | Dennis _F

We seem to have voids show up in one out of 5 BGAs during x-ray inspection. The x-ray is set up to accept the joint with anything less then 30% void area. I need anyones input of what during the process we can do to decrease the voiding and/or a good

Re: Via in the middle of a pad

Electronics Forum | Tue Jan 04 08:40:24 EST 2000 | g cronin

don't you just love those design guys sometimes, this is an issue that pops up every once in a while with us too. We have a couple assemblies that have hundreds of vias on pads. We have tried and had some sucess with: increasing squeegee pressure,

Solder Balling Beading Effect

Electronics Forum | Mon Dec 13 18:17:44 EST 1999 | Calvin Wong

We have this solder ball & beads around chip components since day one of manufacturing using non-clean process. We managed to eliminate the solder beads around ceramic type chip componenets when we have a slow ramp up of pre heat at solder reflow. Ho

Re: Reflow Power Failure

Electronics Forum | Mon Nov 22 10:29:18 EST 1999 | Boca

Hany, Chartrain has some good points, if you product is expensive, what does the cost of a UPS amount to? Remember, you don't want to 'back up' the heating zones, just the controller and conveyor drive system so product doesn't get stuck in the oven

Re: SMEMA

Electronics Forum | Wed Oct 20 05:13:24 EDT 1999 | Paul Gerits

Hi Jorge, As you know SMEMA is a world standard (means it is the same at every vendor and each machine), at DEK you can buy (if not already implemented in your printer) SMEMA communication option. This is a pcb which is set in the machine to enable

Re: Automated Labeling for SMT Assembly

Electronics Forum | Fri Oct 29 10:39:48 EDT 1999 | JohnJ

Bill, Thanks for the input. I took a brief look at the Brady machine on their website. I think their latest is the PAM 6000. It didn't appear it could keep up. My most difficult application is to put 42 labels on a 21-up board in under 1 min 20 sec.

Help with D^2 Pak on MV100 Chipshooter

Electronics Forum | Mon Sep 20 07:30:28 EDT 1999 | George Henning

Can anyone help with programming a D^2 Pak on a Panasert MV100. I'm having trouble setting up the parts data and teach the component. What should the Up, Down, Left, Right, Component Code, Lead Details, and Cut Lead Settings be? A link to the package

Re: screen printing adhesives

Electronics Forum | Wed Aug 25 19:31:22 EDT 1999 | Dave F

| JUST WANDERING IF ANYONE IS PRINTING ADHESIVE ON THE BOTTOM SIDE OF BOARD WITH THROUGH HOLE COMPONENTS ALREADY PLACED. I'VE BEEN TOLD IT IS POSSIBLE BUT WANT TO LOOK INTO THIS PROCESS IN DEPTH. | Chad: You don't need to YELL!!! Anyhow, yes we ha

Bridge on BGA

Electronics Forum | Wed Aug 18 16:26:21 EDT 1999 | Tony

Yesterday as I was creating a profile on a plastic BGA using Conceptronics freedom 2000 rework station, I happend to discover that I was able to remove solder bridging from a plastic BGA. This is what I did. Created a removal profile, I had a board


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