Electronics Forum | Tue Sep 11 09:13:01 EDT 2001 | davef
Like most things in electronic assembly, this is not astrophysics. People have pasted boards, placed components, turned the board up-side down, run the board through a reflow oven, and generalized about which components: * Fall off the board. * Don
Electronics Forum | Mon Aug 01 17:54:02 EDT 2005 | Stefan
If you are using vib. feeders than the component may be flipped length wise by the following components. Components should be landing with the leads on the right side but upside down. If you are using tape feeders the component may be flipped sideway
Electronics Forum | Wed Jul 27 22:43:10 EDT 2005 | crishan
Hi all, Having a major problem with an IC being placed upside down. We pick up the fault at AOI. We have check several reels and the component is not placed upside down by the supplier. Where should I start looking; 1. Are we using an incorrect fee
Electronics Forum | Tue Dec 09 14:03:05 EST 2008 | pms
Steve, We use stencils for applying adhesives to PCB's, with our DEK Proflow system. Works well for us. Once in a while, we have to manually add adhesive to a specific location depending on the component height. Vary rare though. You shouldn't have
Electronics Forum | Thu Aug 29 20:04:13 EDT 2002 | davef
Steve: I agree. Let�s break it down. * I�d rather print paste than glue any day of the week * But I know yera �Dispenser Boy�. In that case, I�d rather dispense glue than paste. * PTH / primary and SMT / secondary is a tough process either way you
Electronics Forum | Wed Jun 11 11:40:12 EDT 2014 | rgduval
As has been mentioned, it's likely that the component is moving in the tape, and flipping over. It is not likely that the pick/place operation is causing this. What I haven't seen mentioned is that there is an acceptability criteria in IPC for inve
Electronics Forum | Thu Aug 11 15:11:35 EDT 2011 | davef
Franx: In response to your follow-up questions ... For the case 1: Q1: Should I apply the glue to the PCB with the same method as I apply solder paste? (with screen printer and squeegee). A1: Correct. Glue can be stencil printed, dispensed, or pin t
Electronics Forum | Tue Nov 25 05:20:20 EST 2014 | grimus
Could be. I am making overprint to achieve proper amount of solder paste inside hole. Now I am trying to reduce maximum overprint and compensate it with step - up stencil. This could reduce effect that some particles of solder paste are not gathering
Electronics Forum | Wed Aug 03 03:01:18 EDT 2005 | woodglass
Regarding the issue of using a pick-up offset: I really can't see any benefit to this if the pockets in the tape are too large, since this means that you cannot be sure that the components always end up in the same position when the feeder indexes.
Electronics Forum | Tue Aug 02 11:17:27 EDT 2005 | Stefan
Tape feeders usually have a fixed pick position regardless of the package size. Is the component body off center in the tape pocket? I hope you can enter an offset in the feeder set up file. Also, perforation holes can deform, if the reel is too hea
