Electronics Forum | Mon May 02 10:49:10 EDT 2005 | pr
We are using a UP2000 so I'm not positive on this but.... The squeegee stroke will have to be taught by and the software will walk you through setting the stroke. What do you mean by "where it drops the pins to load/unload/locate"? If you follow th
Electronics Forum | Thu Jan 27 01:21:48 EST 2011 | eliezerk
How can I print two various heights of solder paste on the same board , no space for graded stencil
Electronics Forum | Wed Apr 11 20:58:12 EDT 2018 | jacobidiego
YES to the first question in some points of the board. Bulky, to the second question when it is not in short. What you say about the PAD height, helped me to understand why the SPI shows weird values for other measurements. I am currently doing test
Electronics Forum | Thu Jun 01 21:19:52 EDT 2006 | ec
Hi Russ, Thanks for your input. Currently, our stencil is at 5 mil thickness and the paste height from 5.5 to 6.5mil. I have increase the paste height to 7 to 7.5 mil and great improve....... I just need some data to present to my management and tel
Electronics Forum | Tue Jan 23 22:21:15 EST 2001 | rpereira
We have evaluated 4 different AOI machines and the General Scanning 8200 machine was the best. Great G R&R. As far as paste height goes, it is very paste dependant. I recently completed a DOE comparing laser stencils to EFab, varying 0.5 mm pitche
Electronics Forum | Tue Nov 25 18:39:59 EST 2014 | rhcriad
We have an MPM UP2000 stencil printer and have a lot of issues with burned out 6410 driver cards (or driver cards just failing to work). I have looked over these threads and found that this is a common issue with these cards. I understand that thes
Electronics Forum | Tue Aug 25 20:33:31 EDT 1998 | Karlin
| | | | Hi, | | | | Does anyone has experiences in reflowing Ceramic BGA and found solder wicking ? Solder wicking has the syndrome that solder being wick from the pad and ended up in the leads. | | | | We have rule out the possibility of not printin
Electronics Forum | Wed May 30 17:59:16 EDT 2001 | jollyrodger
It may be the case (if you are using stencils to apply the epoxy) that you will have to indeed use a stepped stencil to appply the epoxy at a greater height. Not being an engineer i am not completely clear with the involvements of stencil design -
Electronics Forum | Wed May 30 17:59:24 EDT 2001 | jollyrodger
It may be the case (if you are using stencils to apply the epoxy) that you will have to indeed use a stepped stencil to appply the epoxy at a greater height. Not being an engineer i am not completely clear with the involvements of stencil design -
Electronics Forum | Fri Mar 03 14:40:22 EST 2006 | amol_kane
i think a more important issue here would be the reduction ratio. as LF solders have a higher surface tension, they do not flow as well as their leaded counterparts. therefore the stencil design may have to be changed (hence a new stencil) if the red
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