Electronics Forum | Thu Mar 17 09:34:10 EST 2005 | sumxp
What is the spec limit setting for solder paste height control in your area.Is it +/-2mils for 6 mils stencil? Tx
Electronics Forum | Thu Oct 27 07:57:35 EDT 2005 | Bob R.
Nearly all of our assemblies have to meet class 3 requirements and we regularly use 5 and 6 mil stencils. If you've got reasonably well controlled processes you won't have any trouble getting class 3 joints on QFPs and discretes.
Electronics Forum | Sat Apr 25 19:40:01 EDT 1998 | Stan Traxler
| We have to mount our SMD devices 0.1 to 0.4 mm off the pcb | PCb substrate to compensate for thermal stressing in a | Space enviroment. Has any one any ideas or contacts for | dissolvable pads. this only applies to leadless components We have appl
Electronics Forum | Thu Mar 17 13:03:21 EST 2005 | Slow Ride
When it comes to solder paste, you should worry about volume. Granted height is a part of the equation, but you could have perfect height and still get defects. I wouldn't get too wrapped up in volume either, unless you're evaluating stencil height
Electronics Forum | Mon Feb 21 03:51:37 EST 2005 | abhirami
Solder paste thickness control is more important in SMT process. What controls do you have? I guess if everyone follows the critical control path, then there are always reduced problems. The issue is no one is perfect. Paste tends to be on the stenci
Electronics Forum | Sat Feb 19 09:26:19 EST 2005 | davef
Your customer asks a reasonable question. How do you know that your: * Paste has not dried? * Stencil aperatures have not become clogged? * On and on ... Some agrue that printing is the most critical process and that it drives all down-stream failu
Electronics Forum | Wed Dec 08 19:16:20 EST 2010 | jgalarza
Can anyone tell me if there is a formula for finding the after reflow height of solder with no part attached? I have to print some pads that do not have any parts but there can not be more than 1.5mil of solder on the pad after reflow. I am going to
Electronics Forum | Wed Oct 26 14:29:55 EDT 2005 | barryg
We have a class 3 assembly we will be doing soon and I was wandering since the fillet heighth required for class 3 is 50% more than class 2, should I have my stencil thickness increased from 6 mil. to 7 mil.? This assembly is made up of 31 mil. pitch
Electronics Forum | Mon Mar 02 11:13:59 EST 2009 | jorge_quijano
Hi to everyone, I'm new with the Solder Paste Inspection machines, and I'm doing my first measures and I noticed that I'm getting a solder paste heigth of 7 & 8 mils using a 5.0 mils stencil, with metal squeegees and 0.0 Snap off. are this results no
Electronics Forum | Mon Feb 21 04:04:21 EST 2005 | abhirami
1.67 always on the sample boards measured. This is very fast and pretty good measurement for a paste dispense control. Boards do not stand out-side for long times. Inspect the height for critical components only, in the initial stages. Once your Cpk
