Electronics Forum | Tue Oct 12 11:47:51 EDT 1999 | Jose RG
Hi, We are in the process of evaluate our solder paste,incoming inspection over the solder paste, stencil requirments: 1- Is anybody using/requiring 1000 Kcps or more on viscosity to your solder paste provider ? Why ?? 2- Is anybody using step stenc
Electronics Forum | Wed Jan 16 15:22:29 EST 2002 | Terry Burnette
In his book titled "Manufacturing Techniques for Surface Mount Assemblies" author R.J. Klein Wassink describes the relationship between solder land dimensions, component lead coplanarity, board warpage, solder volumes, and solder paste flux wetting b
Electronics Forum | Thu Jun 24 23:52:36 EDT 1999 | Dean
| | | Dear guys, | | | | | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We
Electronics Forum | Wed Aug 22 09:53:06 EDT 2007 | slthomas
"The question is: should we be looking at the operator? the paste? or the setup?" Yes. ;) Those guys love to brag about their 4 corner height adjustment on those printers. The fact is it's a PITA and shouldn't be necessary in the first place. It's
Electronics Forum | Tue Aug 04 10:19:38 EDT 2009 | swag
Here's a few ideas: If it has one, make sure the flexible coupler set screws are tight. Replace the tactile switch (often these appear to work fine in I/O but do not work properly in production). Clean and oil the tactile plunger if it has one. M
Electronics Forum | Mon Aug 24 21:04:58 EDT 1998 | Karlin
| | Hi, | | Does anyone has experiences in reflowing Ceramic BGA and found solder wicking ? Solder wicking has the syndrome that solder being wick from the pad and ended up in the leads. | | We have rule out the possibility of not printing any solder
Electronics Forum | Fri Nov 23 14:47:35 EST 2001 | kgroen
Some comments on the previous post: Be careful when looking at the proportion of SMT defects that are solder defects - you may very well find that only a small few of them originate at the screen printing step. As for specification limits for pas
Electronics Forum | Fri Mar 04 15:22:17 EST 2005 | russ
Glad to hear a little success from ya Duckmann! i have stenciled mask in the past and I can tell you that stencils are expensive. They are basically a step stencil, you will need full thickness for the area(s) you are going to apply mask and you wi
Electronics Forum | Fri Dec 01 14:40:02 EST 2017 | emeto
Very interesting pictures. It shows paste height of 200um - which is at lest 6mil stencil deposit. That on the other hand posts another question. Can you measure the ground pad level in relation to the solder mask level with the SPI? I had assemblies
Electronics Forum | Thu Aug 27 15:40:50 EDT 1998 | Justin Medernach
| | | | | Hi, | | | | | Does anyone has experiences in reflowing Ceramic BGA and found solder wicking ? Solder wicking has the syndrome that solder being wick from the pad and ended up in the leads. | | | | | We have rule out the possibility of not p
