Electronics Forum | Wed Nov 02 01:53:41 EST 2005 | pavel_murtishev
Hello, Thank you for answer. We are using second hand machine. What do you mean saying that �stencil is not height on all 4 corners�? Does it have some inclination between corners? I mean that three corners of stencil are matching with PCB fine and
Electronics Forum | Wed Nov 25 01:00:54 EST 2009 | henry_usa_stencils
The design of the opening apertures for the glue stencil and the metal thickness.Its is very important. The Engineer of the stencils supplier have to look into the height of the components and the gap of the 2 leg(pads)and give the assemly house an s
Electronics Forum | Mon May 20 16:15:48 EDT 2019 | davef
Resources are: * IPC-7525A - Stencil Design Guidelines, 3.5.2 Step-Up Stencil This type stencil is useful when it is desirable to print thicker solder paste in a small portion of the stencil. An example would be a ceramic BGA where it is necessary t
Electronics Forum | Tue Jan 04 17:54:37 EST 2000 | Josue Jacquez
Does somebody knows what should be the max acceptable height for the paste printing process using a 6 mils stencil?? I'll appreciate your help!!
Electronics Forum | Fri Sep 14 01:43:36 EDT 2001 | dhanashekar
please check the following also. in one of the cases we came across the second point was the problem. 1. the parallelisum of the conveyor. 2. the warpage of the board. 3. the stencil.(the differential height in the paste deposition of the two pads
Electronics Forum | Wed Mar 02 05:04:36 EST 2005 | ABHI
What is your micro BGA requiremnets? I mean ball dia / height with a 0.5 mm pitch? I can give you the stencil design, if you make known the parameters.
Electronics Forum | Tue Apr 12 04:37:52 EDT 2005 | chandran
1.Can anyone explain to me what is the clean and non clean solder? 2.What is the standard solder paste height spec for stencils 4mils,5mils and 6mils? 3.Whatis the meaning for ROHS?
Electronics Forum | Wed Apr 27 12:26:49 EDT 2005 | jdumont
Square you say? Wouldnt this give less paste deposition than a circle and basically reduce the standoff height the same as making the pad bigger? Would using a type 4 paste for this size stencil aperture (.013") be a good idea? Thanks JD
Electronics Forum | Thu Feb 23 23:24:14 EST 2006 | KEN
Depends what is adjacent to the step. 1206 chips could reside closer than say a 16 mil fine pitch. Larger apertures are more forgiving to height variations than small apertures.
Electronics Forum | Tue Feb 28 07:47:33 EST 2006 | davef
The key driver to aperture design is to assure a fillet of the proper height for the component temination and the reliability of the end-product customer use environment.
