Electronics Forum | Fri Jun 02 08:50:47 EDT 2006 | russ
Hmmm interesting, we utilize 5 mil stencils and print to same height as you and do not experience these failures. May I ask what paste you are using and what the spacings are of your pad design? But anyhow, if it works it works.
Electronics Forum | Fri Jul 31 17:17:12 EDT 2009 | isd_jwendell
If the sensor can survive the 200C in the molding machine, then could it not survive Pb-free soldering? Maybe not convection reflow, but it should be able to survive vapor-phase reflow. I would control solder height by controlling the amount of paste
Electronics Forum | Thu Apr 30 23:21:52 EDT 2020 | SMTA-Davandran
I am seeing a lot of solder ball for PIP process. is it due to the paste height go beyond 0.2mm.? what is the DOE need to focused for PIP process?
Electronics Forum | Tue Aug 22 15:24:08 EDT 2023 | grayumm
Evtimov, here is a picture of what we are seeing. After evaluating with the IPC-A-610 book it looks like we are getting an insufficient Heel Fillet Height. I will add a picture of an example. UPDATE: i cannot figure out how to add a picture to this m
Electronics Forum | Wed May 24 12:15:53 EDT 2000 | Wolfgang Busko
Bill, I would assume that the stencil rests on the soldermask especially when you use a metallblade. If you know the difference in height between soldermask and land you could take that into your volume calculation when figuring out your desired ste
Electronics Forum | Tue Apr 10 12:56:23 EDT 2001 | slthomas
Didn't you hear? Fendelaz went out of business and sold the rights to the Magnaplancil to Amahlmahay. Sure, all the standard variables still affect the print quality (aka registration and volume) but if the machine controls everything but paste di
Electronics Forum | Fri Jul 23 13:14:17 EDT 1999 | Steve Schrader
| Has anyone ever heard of testing solder paste quality by pasting a board and making a determination of the quality by measuring paste height and width after the board is pasted. Would you consider this a valid test for solder paste testing? | Mar
Electronics Forum | Mon Sep 17 17:39:24 EDT 2001 | johnw
Hi Jeff Am I correct in asumming that the dek requires different stencil designs compared to the mpm ie Take a 6th stencil and print on a dek then a mpm and the results are very diffrent The reason I am asking this is we
Electronics Forum | Tue Dec 09 14:03:05 EST 2008 | pms
Steve, We use stencils for applying adhesives to PCB's, with our DEK Proflow system. Works well for us. Once in a while, we have to manually add adhesive to a specific location depending on the component height. Vary rare though. You shouldn't have
Electronics Forum | Thu Jun 24 15:58:46 EDT 1999 | Adam Pratt
| | Dear guys, | | | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are no
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