Electronics Forum | Wed May 24 12:15:53 EDT 2000 | Wolfgang Busko
Bill, I would assume that the stencil rests on the soldermask especially when you use a metallblade. If you know the difference in height between soldermask and land you could take that into your volume calculation when figuring out your desired ste
Electronics Forum | Tue Apr 10 12:56:23 EDT 2001 | slthomas
Didn't you hear? Fendelaz went out of business and sold the rights to the Magnaplancil to Amahlmahay. Sure, all the standard variables still affect the print quality (aka registration and volume) but if the machine controls everything but paste di
Electronics Forum | Fri Jul 23 13:14:17 EDT 1999 | Steve Schrader
| Has anyone ever heard of testing solder paste quality by pasting a board and making a determination of the quality by measuring paste height and width after the board is pasted. Would you consider this a valid test for solder paste testing? | Mar
Electronics Forum | Mon Sep 17 17:39:24 EDT 2001 | johnw
Hi Jeff Am I correct in asumming that the dek requires different stencil designs compared to the mpm ie Take a 6th stencil and print on a dek then a mpm and the results are very diffrent The reason I am asking this is we
Electronics Forum | Tue Dec 09 14:03:05 EST 2008 | pms
Steve, We use stencils for applying adhesives to PCB's, with our DEK Proflow system. Works well for us. Once in a while, we have to manually add adhesive to a specific location depending on the component height. Vary rare though. You shouldn't have
Electronics Forum | Thu Jun 24 15:58:46 EDT 1999 | Adam Pratt
| | Dear guys, | | | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are no
Electronics Forum | Mon Nov 26 15:30:35 EST 2001 | jhingtgen
To all, For the benefit of everyone there will be a session conducted at APEX on this topic. I have included the information that I pasted from the APEX website (http://www.goapex.org). ADHESIVE PRINTING Chris Marinelli, Loctite Tuesday, Janua
Electronics Forum | Tue Mar 18 09:11:14 EST 2003 | Rob C
With a standard valve and no-clean solder paste you may get a few good dots. But, repeatability will be terrible too many variable, air-pressure, board height (two post nozzle), valve time on/off, retract height, retract time, etc... A RMA paste wi
Electronics Forum | Mon Oct 31 19:03:49 EST 2005 | myu
We need to rework for CCGA1657 (Ceramic Column Grid Array): removal and soldering. Its size: 42.5 x 42.5 mm. Its height is 7.25 - 9.61 mm. We use 63Tin-37Lead water-soluble paste. Our mini-stencil is 6-mil with 27 mil apertures. Please show your expe
Electronics Forum | Tue Nov 28 15:10:50 EST 2006 | M. Sanders
Unfortunately, I don't have a copy of IPC-A-610 D on hand, however, I believe in IPC-610, this �floating height� between lead and pad has no maximum specification restriction. As long as there is no voiding, it is still acceptable for all 3 classes.
