Electronics Forum | Mon Sep 19 09:16:24 EDT 2016 | markhoch
Hi Shriram, Are you saying that there is a trace running between the pads for this 0603 capacitor? If so, this design may be causing a gasketing issue between the stencil and the PCB. The uneven height prevents the stencil from sitting flat on the PC
Electronics Forum | Thu May 23 10:18:02 EDT 2019 | emeto
A little hard to tell without knowing your part details and behavior and your PCB design. I have seen part warping so much that will show opens joints on the sides and short in the middle at the same time. Theoretically you should have area ration of
Electronics Forum | Wed Apr 11 13:32:26 EDT 2001 | slthomas
I think we've miscommunicated....I don't use that thing for measuring paste height or volume as part of the process because it's not repeatable from one operator to the next. I use it more to measure radial tape and reel parts against EIA-486, actual
Electronics Forum | Mon Sep 03 03:32:47 EDT 2001 | johnw
Franky, what method are you using for printing glue? metal stencil or plastic?, and is it on contact or off contact ? and what type of squeegee's are you using? basically give us more infomation. In term's of measuring height / volume, you can do t
Electronics Forum | Thu Apr 17 13:00:28 EDT 2003 | Takfire
Russ, The caps are 0603 case size. I am not sure about the manufacturing details, as I work for the capacitor supplier. The manufacturing details are unclear at the moment, as the customer (South of the border) has not released such detailed inform
Electronics Forum | Tue Nov 27 20:05:31 EST 2007 | shy
Dback, Current method is by using dispenser machine to dispense the glue at PCB. This non-wetting is randomly and not repeating to the same location. My adhesive height is 0.01" to 0.035". Is this will cause the component to had a gap between the t
Electronics Forum | Tue Oct 12 22:22:34 EDT 1999 | se
| Hi, | We are in the process of evaluate our solder paste,incoming inspection over the solder paste, stencil requirments: | | 1- Is anybody using/requiring 1000 Kcps or more on viscosity to your solder paste provider ? Why ?? | 2- Is anybody using
Electronics Forum | Mon Jun 28 11:51:36 EDT 1999 | Brian Wycoff
| | | | Dear guys, | | | | | | | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thicknes
Electronics Forum | Wed Jul 22 11:27:25 EDT 1998 | Russ Miculich
I agree with the response and strongly recommend that you use the "home plate" design to reduce solder ball entrapment, and that the under cut for the 0402's in particular be 80% of the pad size. Solder slump is typically about 1.2 to 1 so spread wi
Electronics Forum | Tue Jun 01 18:06:36 EDT 2004 | Rob
I used an Ultraprint 2000 so if that's what you use then maybe I might be able to help. First, I'm assuming that you've already passed the Teach New Board section. This is board dimension, X and Y boardstop, stencil/squeegee heights and strokes. If
