Electronics Forum | Thu Nov 12 04:35:13 EST 2009 | sachu_70
You can certainly venture out to the nearest lab for in-depth analyses. But since you mention 2-3% defectives in a batch, there is much you can do in-house as well. Measure the height of your solder paste deposit (in zero print gap condition)across a
Electronics Forum | Thu Apr 21 20:09:18 EDT 2016 | adamjs
I have tried adding more paste but get shorts and excess flux as I get above a 7 mil stencil. You do need the thicker stencil. To prevent the shorts, you need to have your pick-and-place machine probe the exact height of the board (at multiple loca
Electronics Forum | Fri Jan 20 20:57:26 EST 2023 | hi_fonsi
We have a PARMI SigmaX SPI (Solder Paste Inspection) machine, right now I'm trying to understand about parameters of the machine. I know minimus, Maximus, and warning values need to be defined. Height value understands that can be defined by the thic
Electronics Forum | Mon Jan 28 16:48:14 EST 2002 | djarvis
Printing with adhesives is no big deal so don't let the sales types try to mystify the process and convince you that they have the only stencils/adhesives/knowledge that can possibly get you through this "trying time" - at a price. Start with 0.010"
Electronics Forum | Tue Jun 13 21:57:01 EDT 2000 | Dave F
Todd: You say: "... solder masking between the lands of fine pitch components can cause stenciling problems and or manufacturing problems." I say: Fine pitch components without solder masking between the lands can cause stenciling problems and o
Electronics Forum | Thu Jun 24 09:57:44 EDT 1999 | Vic Lau
Dear guys, I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are now using a no
Electronics Forum | Thu Jun 24 16:23:18 EDT 1999 | Kennyv
| Dear guys, | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are now usin
Electronics Forum | Wed Jan 22 13:17:48 EST 2003 | slthomas
We're considering stenciling SMT adhesive to increase throughput. This is an as-of-yet unproven process and for that matter pcb design (we've never done anything with more than about 50 SMT parts on the bottom, this board has in excess of 1200, but
Electronics Forum | Thu Jul 07 11:52:25 EDT 2016 | proceng1
We just pulled a Speedline Accuflex printer out of storage. After programming a board and stencil, and calibrating the fiducials and everything, we do a test alignment and bring the board to print height. It is off. I've done it now with two diffe
Electronics Forum | Thu Jan 13 03:56:45 EST 2022 | goseese
Hello, and thank you in advance for your help. I have just received a used DEK 03i and I am having a problem that I don't know exactly how to troubleshoot. The DEK will power up correctly and everything will initialize. When I try to set up a n
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