Electronics Forum | Tue Jun 13 21:57:01 EDT 2000 | Dave F
Todd: You say: "... solder masking between the lands of fine pitch components can cause stenciling problems and or manufacturing problems." I say: Fine pitch components without solder masking between the lands can cause stenciling problems and o
Electronics Forum | Thu Jun 24 09:57:44 EDT 1999 | Vic Lau
Dear guys, I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are now using a no
Electronics Forum | Thu Jun 24 16:23:18 EDT 1999 | Kennyv
| Dear guys, | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are now usin
Electronics Forum | Wed Jan 22 13:17:48 EST 2003 | slthomas
We're considering stenciling SMT adhesive to increase throughput. This is an as-of-yet unproven process and for that matter pcb design (we've never done anything with more than about 50 SMT parts on the bottom, this board has in excess of 1200, but
Electronics Forum | Thu Jul 07 11:52:25 EDT 2016 | proceng1
We just pulled a Speedline Accuflex printer out of storage. After programming a board and stencil, and calibrating the fiducials and everything, we do a test alignment and bring the board to print height. It is off. I've done it now with two diffe
Electronics Forum | Thu Jan 13 03:56:45 EST 2022 | goseese
Hello, and thank you in advance for your help. I have just received a used DEK 03i and I am having a problem that I don't know exactly how to troubleshoot. The DEK will power up correctly and everything will initialize. When I try to set up a n
Electronics Forum | Thu Jul 01 13:57:57 EDT 1999 | Kris Wiederhold
| Dear guys, | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are now usin
Electronics Forum | Fri Dec 09 15:10:55 EST 2011 | davef
Can you use the equipment manual as the basis for learning how to use the machine? Each model of printer has different alignment techniques. We don't have a clue of your model type. So, we'll approach the question from its most basic point. Registe
Electronics Forum | Thu Oct 07 09:59:01 EDT 1999 | Dave F
| I recently had the opportunity to visit the vendor who is making my boards. On my trip I noticed that the guy who was in charge of the SMD placement machine (brand new Samsung) still had to manuallly place about 20%-40% of the parts after placement
Electronics Forum | Fri Feb 16 09:30:38 EST 2007 | DEK Answer Guy
Hello PR, PumpPrint� technologies enable high throughput adhesive deposition using a screen printing platform. Careful selection of stencil material, and informed study of the design of apertures and other stencil features, enables a wide range of
