Electronics Forum | Thu Mar 31 07:56:31 EST 2005 | cn
I agree with chuck, but would like to add. 2D is a great option and helps to keep your printing process in check, it will measure the x & y coverage on the pad. It will help you determin when your stencil aps become clogged or when the bottom of your
Electronics Forum | Wed Mar 02 05:14:07 EST 2005 | ABHI
Guys, Solder paste height worries all of us as we encounter the non wets after reflow. More so in fine pitch QFP's. The non wets are not always caused by solder paste height. Many other contributors. Even the pad geometry on te board can contribute t
Electronics Forum | Mon Feb 21 02:02:54 EST 2005 | JSS
First of all THANKS for thr reply. I totally agree with u that paste dried,stencil aperture clogged like probs comes during the production but we hv a visual inspection stage (with 5X illuminated lamp)after printing process and before inserting the
Electronics Forum | Tue Feb 22 01:38:42 EST 2005 | JSS
We r using QFPs of 0.5mm pitch and r not getting any soldering prob at the end.But some new customer insists upon the thickness check of the solder paste after printing. At present we don't hv thickness checking system.We r controlling the amount of
Electronics Forum | Thu Mar 17 09:56:34 EST 2005 | jmedernach
Tx, Your spec limit is the point at which you expect to see a failure. In other words, what is the probability that you'll see a short when you have .008" of solder paste? What is the probability that you'll see an open if you have .004" of solder
Electronics Forum | Wed Sep 07 03:03:35 EDT 2005 | Milroy
I am engaged with SMT production and we are going to have a brand new SMT line and I am studing about the screen printing and I have seen most commonly used stencil thickness is 6mil and I need to know what is the best solder paste height we can achi
Electronics Forum | Thu Sep 08 03:40:59 EDT 2005 | GS
do not forget also wich Type of paste used( granulometry) if Type-3 ? Type 4? etc, it could change in final metal on your pads/joints. Regards GS
Electronics Forum | Thu Sep 08 01:58:08 EDT 2005 | darby
0. Any less and you are scooping the paste from the aperture with the squeegee blades. I'm not saying that either of these situations is a good or a bad thing, it's just that if you buy a 6 mil stencil, you are trying to achieve 6 mil paste height.
Electronics Forum | Tue Dec 11 19:48:37 EST 2007 | arun2382
Hi, If I were working with a 75 um thick stencil, Is there a spec. as to what the maximum value allowed on actual solder height measurements? Stencil type: Laser cut and electropolished Solder paste type: Type 4 Sn-Sb Would the measured values va
Electronics Forum | Fri Apr 20 15:27:00 EDT 2001 | jimlew
We do some aperture reductions - but it's not the 10% i'm accustomed to. Looks like it should be more than we currently do (I think we do 10% of length, but no width). Don't think we have a slumping problem, and we're not doing snap-off, only contact
