Electronics Forum | Thu Mar 29 01:22:57 EST 2001 | chinaman
Hello everybody, Two questions came up during an audit (old topics once more): 1. we are not checking the solder paste volume/pad height after printing - others are using an AOI, but is it really necessary? We just do visual inspection randomly. We
Electronics Forum | Tue Dec 14 12:00:34 EST 1999 | Kris Wiederhold
We recently reduced our standard aperture reduction to aid in the reduction of solder on gold defects. Since this reduction in aperture size, we have been experiencing exposed copper at the end of the component pads. The heel and toe joints are per
Electronics Forum | Wed Apr 16 10:45:16 EDT 2003 | Takfire
Recent cross-section analysis for a customer complaint revealed voiding in the solder fillet. In some cases, the remains of outgassing were also observed. During the failure analysis, we also observed failures where the solder fillet wicked on the
Electronics Forum | Fri Sep 10 17:32:59 EDT 2004 | Yngwie
We have recently faced lifted lead problem that happened on our 20 mil pitch QFP. We have infact pushed it back to the incoming quality, but still I have a few questions to bring up : 1) what is the typical coplanarity tolerance that ICs' manufactur
Electronics Forum | Fri Oct 14 15:44:30 EDT 2005 | fastek
Yes....interesting. Word is this better be successful for them or they are done. At first glance my issue would be what impact do solder paste "dots" have in the following areas compared to stenciled paste: 1) Controllable with regards to volume 2
Electronics Forum | Wed Dec 14 23:32:19 EST 2005 | jhernan9
Hi, I'm having a lot of problems with BGA's shorts, we are using 0.005" stencil aperture 1 to 1 (0.014)", the paste is centre (I can not measured the height)was verified using electronic microscopie, the placement is centre (I'm using local fiducials
Electronics Forum | Thu Oct 12 08:12:51 EDT 2006 | realchunks
I have, but not for what you are trying. Different ovens and styles react differently when you try this, so you have to experiment to see how far you can go. Why do you think different temps top and bottom will solve the coplanairty issue? Is this
Electronics Forum | Wed Jun 24 18:44:14 EDT 2009 | mark_h
Hi Everyone My company has done loads of 0402 placements but are now required to start looking at 0201 and micro BGA placements. I’ve done loads of research and I’m happy with stencil design, area ratio, oven profile, machine requirements and paste r
Electronics Forum | Tue Aug 04 09:02:34 EDT 2009 | kpm135
We replaced the tactile sensor's linear actuator on a MPM Ultraprint 2000 HiE. Now we are getting a Tactile Hardware limit error every time we try to find the stencil height. I was hoping some one could explain why we're getting this error and any i
Electronics Forum | Mon Feb 04 22:29:55 EST 2013 | armandogomez
This is a very common question, I can relate to your question I have here almost the same setup on the smt line, printer a DEK, MY12 and an awful versatronics oven, about the question about the responsibilities, here the operator has only the knowled
