Electronics Forum | Fri May 09 14:40:38 EDT 2014 | hegemon
I might start with the equivalent 4 or 5 mil stencil and 1:1 on the apertures. If voids are too prevalent, then I would tin the pads of the device, remove the solder, and then solder as above. You may have another hurdle, in that the resulting stan
Electronics Forum | Thu Aug 12 22:31:10 EDT 1999 | Dave F
| Hello, | | Can any netters suggest what critical parameters should be considered & what are there assoicated impacts for a solder paste printing process ... | | B.Regards, | Felix | Felix: There are some 30 variables that affect SMT solder qua
Electronics Forum | Thu Jun 24 13:12:15 EDT 1999 | MD Cox
| Dear guys, | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are now usin
Electronics Forum | Mon Mar 15 23:00:40 EST 1999 | Dave F
| In the early days, we used screens made of stainless steel or polyester. Sometimes - after A period - the tension was not good, because A wire was broken. | Later on we started to us metal stencils, glued in A polyester screen. even than we had som
Electronics Forum | Tue Mar 16 08:38:59 EST 1999 | George Verboven (Process Engineer)
| | In the early days, we used screens made of stainless steel or polyester. Sometimes - after A period - the tension was not good, because A wire was broken. | | Later on we started to us metal stencils, glued in A polyester screen. even than we had
Electronics Forum | Wed Dec 02 16:35:21 EST 2020 | kylehunter
> Hi Kyle, As per IPC 610, for class 3, this is > not acceptable, as your minimum fillet height has > to be either one of these two, whichever is > less: - solder thickness + 25% of the termination > height - solder thickness + 0.
Electronics Forum | Mon Feb 22 12:04:15 EST 1999 | Dave F
| Please could you suggest a recommended aperture sizes for | printing of smd adhesives. Any recommendations on stencil thickness as well as stencil finish will be appreciated. | Mark: About the only rule of printing adhesives is: Keep it off the
Electronics Forum | Thu Sep 28 07:09:01 EDT 2000 | Rich Ziebell
All, We are experiencing extreme difficulties in printing with a water soluble paste. We have tried two major brands of w/s paste and we are seeing the same problems with both. The main issue is the paste is sticking to the blades. We have tried di
Electronics Forum | Fri Jul 13 19:08:55 EDT 2001 | mparker
Home plate apertures are designed to reduce or eliminate solder balls that occur when placing a chip and reflow of the solder. This aperture type is usually desired when processing with a "no-clean" solder paste. The design of the aperture is usually
Electronics Forum | Tue Sep 24 12:49:43 EDT 2002 | dragonslayr
Aperture reduction @ 5 mils thickness is your best bet. It may take several attempts to get just the right paste volume. What aperture reduction was specified to the stencil house for these specific LEDS? or was the stencil blindly produced using a
