Electronics Forum | Fri Nov 23 06:34:43 EST 2012 | bandjwet
With all of the various techniques available for LGA rework including but not limited to: Bumping the part using a polyimide stencil http://www.solder.net/products/stencilmate Bumping the part using a metal fixture or http://www.finetech.de/advance
Electronics Forum | Wed Jul 31 07:51:31 EDT 2019 | ameenullakhan
Hi Dave, lead is 80Pb/20Sn. Top joint off CCGA lead is SN63/Pb37. Thermocouple was placed at center lead of the CCGA and one at the corner lead of CCGA. Ramp Rate Center 1.09 Corner 1.26 Soak ( 140 - 160 deg C ) Center 37sec Corner 38sec Ref
Electronics Forum | Tue Nov 12 09:04:21 EST 2019 | mario85
Hello Guys, I'm new here. I am smt process engineer in new company located in Poland. I am responsible for whole smt line, so I have a lot of problems at the beginning :). I would like to ask about few things. The topic is solder balls. I produced s
Electronics Forum | Mon Jan 15 16:32:46 EST 2001 | Darby
Adrian, I'll go again. The term "snap off" on it's own refers to the distance between the bottom of the stencil and the top of the pcb. Sometimes referred to as "print gap". As you prefaced your question with "squeegee snap off" I thought you were as
Electronics Forum | Thu Jun 24 18:24:13 EDT 1999 | Christian N.
| Dear guys, | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are now usin
Electronics Forum | Wed Apr 08 05:41:37 EDT 1998 | Alan Pestell
We currently use the Loctite system of Glue/stencils and are getting very good results. You may still have a height problem is you solder resist is too thick. The UK sales person is Bob.goss@loctite-europe.com & he may give you more help. The only ot
Electronics Forum | Sun Apr 26 08:36:55 EDT 2009 | davef
First, in direct answer to your question, DOE printer setup variables (MPM): * Squeegee speed: 0.5 to 1.0 in/sec * Pressure (metal): 1lb/in of blade * Pressure (plastic): 1.6-3 lb/in Second, supprting earlier responses, most people monitor paste hei
Electronics Forum | Mon Nov 01 16:41:58 EST 1999 | Robert Culpepper
Hello Mark, I can�t provide any hands on feedback with 0402 packages but we are using a no clean process with 0603 devices. Here are some parameters which will affect solder balling. Stencil thickness, aperture size, paste viscosity, snap off and bot
Electronics Forum | Wed Oct 25 10:11:09 EDT 2000 | Wolfgang Busko
Paddesign, aperture size and stencil thickness determine the amount of solder for your joint. Once you have found suitable parameters you need to control the volume of your paste deposit which is influenced by printer settings, paste condition, stenc
Electronics Forum | Fri Dec 28 17:44:41 EST 2007 | flipit
Back in the mid 90s I used an SVS 3D solder paste inspection system. We used it as a stand along unit but it was an inline model. We would bring printed PCBs off the Dek 265 solder printers and check every 5 or 10 printed panels. They almost alway
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