Electronics Forum | Mon Mar 02 00:38:35 EST 2009 | sachu_70
Hi Jorge, The success of such production purely depends on process control. One needs to first understand the board layout in detail, and evaluate any critical components for their temperature handling capabilities. Remember, you are dealing with com
Electronics Forum | Tue Sep 24 22:29:04 EDT 2002 | davef
First, I don't have a clear fix on the problem. Please drill-down to more detail. We appreciate that you probably don't know the parlance. Just describe what you have and then what you'd like to have. Second, most 0402 LED are fabricated just lik
Electronics Forum | Mon Jul 30 12:41:47 EDT 2001 | hinerman
1. Realizing not all PCBs will be warped, but for those that are, the tooling can be set when the board is in contact with the stencil, which will take out some warp. On an MPM, the vacuum box helps to hold the board flat If the warp is more sever
Electronics Forum | Tue Mar 13 11:50:21 EST 2001 | gsmguru
Here is some general things I usually ask myself when having trouble with BGA's What type of BGA ? Pitch/Bump Dia etc. Smaller bumps sizes & tighter pitches require more attention. This also impacts stencil aperature design & paste selection. Was
Electronics Forum | Tue Mar 13 14:17:00 EST 2001 | blair
Thanks a lot for the response 1) there are 8 BGA on this board 6 PBGA, 1 TBGA and 1 ESBGA (metal lid). They are dispersed over the board (approx 11"* 14") 2) Is there a tool to use to understand pitch/bump size and stencil aperture (optimized)? 3) Y
Electronics Forum | Fri Jun 29 23:10:02 EDT 2001 | Danial
Thanx for the reply guys!! The problem happened on only one PBGA, the balls are eutectic and the paste volume height is at 5.96 mil min. The stencil opening has been increased to 30 mil which initially was 20 mil. You guys are right!! One probable
Electronics Forum | Fri Dec 17 16:07:07 EST 1999 | Alex B
Hi, C.K. Let's assume that your stencil's thickness is in a range 4-6 mil or by other words the height of the solder paste on a pads is the same (close enough to reality) Therefore, for pad's width more than 20 mils(as well as pitch between pads) th
Electronics Forum | Sat Jul 24 00:31:21 EDT 1999 | Scott McKee
| Has anyone ever heard of testing solder paste quality by pasting a board and making a determination of the quality by measuring paste height and width after the board is pasted. Would you consider this a valid test for solder paste testing? | I ag
Electronics Forum | Tue Jun 01 16:42:48 EDT 1999 | Scott S. Snider
| After lots of years with Panasert machines, I am starting to need to learn again. | 1. For the AP-20 can you retrofit 3D vision? Would you bother? | 2. Also for the AP, can you use 20x20 DEK screens with an adapter? | | Thanks to all you MPM expe
Electronics Forum | Tue Jul 28 16:37:24 EDT 1998 | Terry Burnette
| I think that in general it's best to deposit paste in order to increase the part standoff. This helps improve the fatigue-life of the joints by providing more strain relief. But I know from experience that it's tough to deposit paste during the r
