Electronics Forum | Wed May 29 07:41:33 EDT 2024 | tommy_magyar
We use the same component on many different products, never faced a similar issue. However, things I would check are: - stencil thickness (ideally 125um) - additional Z move on the parts around the relay (as suggested by kumarb) - check the packages
Electronics Forum | Mon Nov 26 14:49:20 EST 2001 | mparker
1. The formula for cubic area (LxWxH) applies to get the expected volume target value. Caution- do not assume the pad surface square are is correct for the part. Do consider the footprint of the device beign placed and its solder requirements to cre
Electronics Forum | Wed Mar 27 19:26:53 EST 2002 | ianchan
After a whole night's self review, I think we can term the slant/tilt as "floating 0805, yet end-terminals have acceptable solder joint formation". the width portion of the 0805 RES/CAP is (floating)elevated from the PCB pad, yet both (width) termin
Electronics Forum | Tue May 09 22:57:58 EDT 2006 | davef
The NexLev connector is built in a stripline construction, providing a continuous ground plane for each signal contact. The connectors come as tenrow connectors with 100, 200, or 300 positions at possible stacking heights from 10 mm to 30 mm. Technic
Electronics Forum | Sat Jun 12 00:34:00 EDT 2004 | kanwal324
Hi ! The main problem being faced currently is formation of solder balls - to be precise, these are micro solder beads generally found attached with bodies of SOTs, Chip Caps, Chip Resistors, between pins of SOICs (50 mil) - lying on PCB surface,
Electronics Forum | Tue Dec 04 08:34:07 EST 2007 | davef
We no advice to give you on the topic, but maybe while you're waiting for others to reply, reading a trade journal article on the topic might help. Below is a link to "Pin-in-hole reflow (PIHR) and lead-free solder joints" by David Bernard, Bob Willi
Electronics Forum | Sun May 23 15:12:59 EDT 1999 | JohnW
| We are running a number of boards with 8-10 25 mil PQFPs on board. Our process is mature with at least 3 years experiance and statistically few opens on the QFPs. Our beloved purchasing department has chased the almighty $ and changed FAB vendor
Electronics Forum | Fri May 07 18:01:11 EDT 1999 | Bill Schreiber
Just a note about cleaning SMD adhesives. Cleaning does not need to be hazardous. Smart Sonic has a non hazardous process that has been used for over 9 years using a non hazardous detergent that has been certified by the AQMD as a clean air chemist
Electronics Forum | Fri May 07 18:02:37 EDT 1999 | Bill Schreiber
Just a note about cleaning SMD adhesives. Cleaning does not need to be hazardous. Smart Sonic has a non hazardous process that has been used for over 9 years using a non hazardous detergent that has been certified by the AQMD as a clean air chemist
Electronics Forum | Tue Mar 13 16:05:30 EST 2001 | rob_thomas
Hi, can you definitely attribute the 30%yield to poor bga soldering? What is your high flyer defect encountered on the failed boards.Is this ICT ,flying probe ,functional test yield? Can you determine a defect pattern? Did your subcontractor provided
