Electronics Forum | Thu Oct 24 03:03:13 EDT 2002 | harriss
Hi: The component height will increase on the PCB after reflow soldering. But i don't know the accurate data of the increased height. Who can help me to get it? The stencil thickness is 5 mil we used. Thanks Harriss
Electronics Forum | Wed Dec 12 21:43:16 EST 2007 | davef
There is no specification for solder paste height, just as there is no specification for paste volume. Focus on producing a fillet that meets J-STD-001. You make the choices that produce the end result.
Electronics Forum | Wed Jan 30 03:01:39 EST 2019 | robl
You could use a stepped stencil around the parts you're having issues with to add a greater paste deposit to them and not the rest, or slightly elongate the apertures and overprint, but this may lead to solder balling.
Electronics Forum | Fri Apr 20 11:05:23 EDT 2001 | gcs
Just a bullet! My results are, .005" stencil thickness should measure between .0055" - .006" if your pressure is correct, metal blades and snap-off is set up correctly. Do you have aperture reductions at the QFP locations "typicial industry standard
Electronics Forum | Wed Jan 30 02:50:33 EST 2019 | electronics101
Hi Steve Thanks for coming back to me, you are correct IPC class 3 is required. We are getting great wetting onto the device but not as per IPC 3 with the wetting rising about 0.25mm. I am questioning whether it is actually possible with such a (re
Electronics Forum | Fri Apr 20 08:41:56 EDT 2001 | jimlew
For those of you out there, like myself who are still using 2-d to measure paste ht, I have 2 questions. 1. Typically, what tolerance are you applying to your ht? +- 1 mil, or what? 2. Are you using metal squeegees, and if so, have you found that squ
Electronics Forum | Fri Sep 17 08:03:04 EDT 2004 | soease
Hi Simon, thanks for answering so fast. Well, our company is building several different products to monitor turbine activities (power generation and propulsion). So our boards are equipped with mixed technologies including minimelfs, 0402 chip resis
Electronics Forum | Wed Mar 16 09:06:07 EST 2005 | russ
This is what I might do, I would purchase either a solder volume (preferred) or at the least a paste height measurement piece of equipmment, The most important parameters with pronting are volume and registration. You need one of these inspection
Electronics Forum | Thu Jan 07 16:40:26 EST 1999 | MMurphy
| | What kind of equipment are you using to gauge the thickness of your stencil after it's used for some months? How to determin the condition of the stencil? Your input is much appreciated. | | | | Ken Mok, based in Shenzhen, China. | | | | | |
Electronics Forum | Fri Sep 17 23:11:30 EDT 2004 | KEN
I have an application that uses 0201 devices coupled with ceramic column grid arrays. The coplanarity of the balls is specified not to exceed 7 mils! 4 mil foil for 0201's with a selective buildup to 7mil for the ceramic. Bloody designers! Take y
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