Electronics Forum | Tue Jan 12 16:16:21 EST 1999 | Sanjay Bhatikar
For process management with SPC of the stencil printing process with a fully automatic stencil printer, what process outpur parameter would you recommend for SPC? It appears to me that there are two options: A: to have a pn chart based upon the % of
Electronics Forum | Wed Aug 05 08:57:23 EDT 2020 | oxygensmd
Snap off is an option to make distance between PCB and stencil. If the distance not enought, adjust the PCB thickness too. Mostly we don't use snap off, I more prefer if the stencil is tight with the PCB - I know, this make the stencil lifetime worst
Electronics Forum | Thu Oct 02 12:22:26 EDT 2008 | JerryS
Hello Ok there is not much info here. What you have to mae sure of is several key factors. 1. Have you entered the correct stencil thickness. 2. Are you using the stencil gerber (not the paste layer) The paste layer is usually not adjusted for ap
Electronics Forum | Tue Aug 04 01:55:29 EDT 2020 | cbeneat
How much adjustment is needed? Adjusting the snap off will get the PCB tighter/looser to the stencil. But this is only a 3 to -3 MM adjustment.
Electronics Forum | Wed Aug 05 06:34:33 EDT 2020 | oxygensmd
Yes if you adjust the thickness to be thin than the machine raise the PCB more to the stencil - than the foil have better tension but it string out faster.
Electronics Forum | Mon May 07 16:07:05 EDT 2012 | davef
Start with targets based on the stencil thickness (for height) and stencil thickness times the aperture size (for volume). * Set reasonable upper and lower control limits (+ 25% and –25 % of the targets, for example). * Next, check the printer set-u
Electronics Forum | Mon May 07 10:42:09 EDT 2012 | saju86ece
Hi, I need one clarification about solder paste printing height tolerance. How to define and fix the solder paste height tolerance after screen printing for inspection purpose. Currently we are using 5mils thickness of stencil, in that we are gave
Electronics Forum | Thu Oct 02 17:00:44 EDT 2008 | davef
Is that accurate? If so, what are your aspect & area ratios? [Similar to the JerryS comment above.] * You say, � � and the average height is very high: nearly 200 pct.� => Our troop can make paste that height too. They snap the stencil-off a fast as
Electronics Forum | Mon Feb 16 16:37:40 EST 2004 | adlsmt
I would try it dry first, we have never used solvents in our SPM, AP-20 or UP2000. Wipe every 4 to 10 boards. Normally dont have to wipe when using epxoy.
Electronics Forum | Tue Jan 12 19:07:07 EST 1999 | Earl Moon
| | For process management with SPC of the stencil printing process with a fully automatic stencil printer, what process outpur parameter would you recommend for SPC? | | | | It appears to me that there are two options: | | A: to have a pn chart bas
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