Electronics Forum | Wed Aug 30 06:56:34 EDT 2006 | billyd
Keep in mind; if you're building warped or twisted boards, do NOT use the Grid-lok system on them, as they tend to conform to the bend or twist of the underside of the PCB, so it will not flatten or straighten out much at all when it's brought to the
Electronics Forum | Tue Aug 01 19:52:19 EDT 2006 | darby
If your frame size is 730mm x 730mm then you can't move it left or right. If it smaller than that then the frame adapter will give you more leeway. I am not too sure by what you mean by "If I had a 6" board, and a stencil with cut-outs for both side
Electronics Forum | Wed Nov 20 16:27:15 EST 2002 | pjc
FYI: MPM does in fact offer alternate board support tooling than the vacuum box system. They have the X and Y snugger tooling, which clamps the board and uses magnetic support pins. If you are looking at a used UP2000, check to see what tooling it ha
Electronics Forum | Fri Feb 12 19:02:21 EST 1999 | Jon Medernach
|As the squeegee shears the paste at the face of the stencil the vehicle used to contain the solder spheres compresses and expands out the top of the opening after the squeegee passes. This is 1 or 2 mil at most. The peaks should not be considered
Electronics Forum | Fri Jan 05 19:47:08 EST 2001 | slowe
Hey everyone, Does anyone out there use a solder paste height measuring system ? I would like to know what the standard is for paste height compared to stencil thickness and how you use it as a process tool. I appreciate any help. Thanks, Steve.
Electronics Forum | Sat Jan 06 10:37:43 EST 2001 | Dave F
We have talked about using mircoscopes and laser thingies for measuring paste height on SMTnet previously. [Fine SMTnet Archives might give background.] Some people use a 0603 chip cap as a standard. I'm not sure how stencil height relates. Paste
Electronics Forum | Tue Mar 25 08:35:49 EST 2003 | pjc
AccuFlex is the replacement for UltraPrint 1500. UP1500 is going obsolete. AccuFlex was desgigned for fast setup and changeovers and takes some tasks away from the operator. The UltraPrint 2000 was designed for high production, even though many users
Electronics Forum | Fri Jul 15 16:27:55 EDT 2005 | davef
It depends on how much paste you put on the pads. Assuming your stencil is 1:1 to the pad and the solderability protection on the board is something other than HASL, we'd guess that your solder height is approximately 50% of your stencil thickness,
Electronics Forum | Wed Sep 30 05:10:28 EDT 2015 | aemery
SWAG does make a good point. The tool he is talking about is located on setup page 1 in the vision box and is labeled FP Mode (Fine Pitch) mode. BY default the setting is "0" this means that once the machine is put into auto mode the camera or visio
Electronics Forum | Fri Sep 25 16:47:57 EDT 2009 | esoderberg
0.5mm pitch QFP's are typically mixed with large components on all of my boards. I usually use a 6 mil stencil with a minimum aperture width of 10 mils. Normal aperture size is 10 x 50 which causes shorts about 20% of the time. A recent purchase of
