Electronics Forum: ups (Page 791 of 1180)

Re: Reflow glue and past.

Electronics Forum | Wed Feb 09 21:29:28 EST 2000 | Dave F

Charlie: People cure glue using their paste reflow profile all the time. And most of them are happy. Personally, I�m with Dean and Travis. It�s possible to as you suggest, it�s appealing not to mess with your oven profile, but it just doesn�t s

Re: Beat rate

Electronics Forum | Sat Feb 05 09:01:15 EST 2000 | Dave F

JS: The issue is not how efficiently/effectively that you can run your placement machine, probably. The issue is how efficiently you can run that part of your assembly process that is the bottleneck. Other than improving quality, optimizing any pa

Re: BGA Rework options

Electronics Forum | Thu Feb 03 20:45:28 EST 2000 | Gary

I have worked with the PDR type rework station on and off for 12 years and have found that the IR can offer a lot of advantages over hot air. As was mentioned the lack of nozzels is a great advantage. The back heater takes a while to warm up but on

Re: Zero-Ion Ionic Tester

Electronics Forum | Wed Feb 02 16:36:22 EST 2000 | Mike Konrad

As the manufacturer of the Zero-Ion, I must correct one statement made by Dave F. According to the EMPF report sited in Dave�s response, �Static� based systems actually are more susceptible to carbon Dioxide adsorption than �Dynamic� based systems.

Re: Touch up on 0603 Chips ( Ceramic caps)

Electronics Forum | Wed Feb 02 11:48:48 EST 2000 | Christopher Lampron

Dave, Ashok mentioned that the end termination of the component were dull and grey. I have had similar problems with Murata components exibiting the same characteristics on the end terminations. As it turns out, they have some exotic plating material

Dross/Oxide problems with wave soldering machine

Electronics Forum | Sat Jan 29 16:35:33 EST 2000 | Robert Steltman

We have a Seho wave soldering machine and cannot seem to get rid of dross that is being generated within the solder pot, and is being pumped out in the wave. It is not the same kind of dross that forms on the surface of the solder pot(this is very m

Re: Siemens 80s20 throughput !!

Electronics Forum | Fri Jan 21 05:39:58 EST 2000 | Scott Davies

Hi ZJJ, I know exactly where you're coming from on this one! We have a similar situation here with a SiPlace 80S-15, rated at 15K max per hour. In practice, we achieve about 11K. The reason is fairly straightforward. The quoted maximum placements pe

CALCULATION EQUATION FOR 1 CHIP SOLDERING COST IN SMT PROCESS.

Electronics Forum | Mon Jan 17 02:40:17 EST 2000 | park kyung sam

Hi. smtman would someone answer me ? it's just the stuff pop ups without deep thinking. how much do our department spend money for 1 chip soldering. what should i consider ? i wonder i spend more money than other guys out there for 1 chip soldering i

Re: Immersion White Tin Process for PCB Finish

Electronics Forum | Fri Jan 14 08:05:23 EST 2000 | Pat Pepper

Hi Dave, Thank you for the response. In answer to your responses I'll use the original numbers of my questions. 1. We would like to turn around our boards fast, but sometimes due to the market conditions we wind up with inventory. After reading

Re: gsm software question

Electronics Forum | Wed Dec 29 18:01:13 EST 1999 | JAX

What's happenin Larry, I am not sure if bump proccess E is available on this particuliar software rev. but I have forgotten?????? It shouldn't matter; bump proccess A will work fine. The only things you have to do is make sure the pick up point


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