Electronics Forum | Tue Feb 13 15:56:16 EST 2007 | darby
Campos, This is a direct reply I recieved from Indium, (thanks to Rich Brooks), in late 2004 regarding SMQ230. I have followed these guidelines with good results using ENIG finish. Same also applies to Indium 5.1 apply to both alloys (SAC 387 and 305
Electronics Forum | Fri Apr 27 22:16:16 EDT 2007 | the silicon horizon
www.thesiliconhorizon.com turn your toaster oven into a SMD reflow oven! this controller can be standalone with LCD and keypad, or through USB with our free software! change pid gains, profiles, program to controller, print graphs and much much mo
Electronics Forum | Wed Oct 17 02:53:36 EDT 2001 | dszeto
The fine pitch QFP is a 240 pin one being loaded with other components on a 2.0mm thick FR4 PCB. There are 6 of this Qfp's on this PCB showing the same charactristic of bowing therfore the solder fillets are vary from the center to the end of the pa
Electronics Forum | Mon Jun 30 16:35:13 EDT 2003 | davef
Hi Steve We don�t double reflow this part. We wouldn�t consider it without a fixture or some other support. You know that sound, the almost involuntary sound that patrons in a restaurant make when a waiter drops a glass or a tray? It�s kind of an
Electronics Forum | Tue Jun 11 06:24:07 EDT 2013 | trottmann
thanks. 1. yes, i understand this requires SMT > assembly. > > 2. For bigger components (USB and > phone jack), how can these be placed > automatically on PCB? The manual process will be > slow. Hello, Use "THR Through-Hole-Reflow" also calle
Electronics Forum | Thu Jan 07 09:58:14 EST 2010 | kjs123p
Pull the hard drive out and use a USB to IDE adapter to copy the whole hard drive onto another computer. I do this with my reflow oven and screen printer. It works very well.
Electronics Forum | Fri Nov 12 13:07:45 EST 2010 | G8reflow
Hi, The focal point of my research has been to recommend a reflow oven and develop a process for a small to low-medium production SMT soldering with the following considerations. - Lead-Free - Low to low-medium production - Forced Convection reflow
Electronics Forum | Tue Oct 10 14:46:35 EDT 2023 | tommy_magyar
We order bespoke carriers for some of our products, made of Durastone, however, a 1.8-2.0 mm thick FR4 sheet will do the job you require too - as previously suggested.
Electronics Forum | Thu Oct 08 11:33:16 EDT 2009 | cab
We are currently wirebonding MCMs with surface components located in very close proximity to wirebond pads, which are gold plated. We are ball bonding with 99.99% Au wire. Normally we do not have problems, however if product has been reflowed seve
Electronics Forum | Thu Oct 29 20:19:43 EDT 2009 | 89jeong
Hi. We are doing Au bonding on Al bond pad not Au plated. If pull strength is less than 2.0g, i think that the ball or stich may be lifted from bond pad. And the value become lower after several reflow. I expect that the surface of bond pad may be c
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