Electronics Forum: usb 3.1 type c (Page 1 of 1)

IPC 7530 section 7.3.1.1 Regarding K type thermocouples

Electronics Forum | Sun Sep 29 13:04:58 EDT 2013 | KIC-Tech Service

Sr. Tech, As far as I’m aware, most if not all, manufactures of thermal profilers offer K type thermocouples as a standard for profiling in the electronics manufacturing industry. In my decades of experience in the reflow and wave solder industry, t

IPC 7530 section 7.3.1.1 Regarding K type thermocouples

Electronics Forum | Fri Sep 27 10:49:41 EDT 2013 | cyber_wolf

So I am reading about K type thermocouples in the IPC 7530 Guidelines and it says : "At temps above 250c it may suffer from temperature cycling hysteresis and may not be the best choice." Uhhh... It looks like the best choice is an N type thermocoup

IPC 7530 section 7.3.1.1 Regarding K type thermocouples

Electronics Forum | Mon Sep 30 04:27:40 EDT 2013 | grahamcooper22

I am not sure what the IPC spec is suggesting....K type thermocouples are normally specified upto 1250 C, of course there is a tolerance in their accuracy and this probably degrades after hundreds of uses through a reflow oven, but normally the accur

Reflow oven recommendation

Electronics Forum | Fri Nov 12 13:07:45 EST 2010 | G8reflow

Hi, The focal point of my research has been to recommend a reflow oven and develop a process for a small to low-medium production SMT soldering with the following considerations. - Lead-Free - Low to low-medium production - Forced Convection reflow

LED Stick To Cover Tape

Electronics Forum | Mon May 17 13:34:22 EDT 2010 | davef

If it's not adhesive, try an ESD-type ionizer. The objective of an ionizer is to eliminate surface charge on insulators and on isolated/ungrounded conductors. Practically speaking, the action of an ionizer is to drive the voltage on the surface of a

Foam fluxer maintenance, storage and cleaning

Electronics Forum | Mon Nov 09 09:44:22 EST 2015 | davef

Purpose. This describes setting-up a wave soldering system set-up for a new assembly design or checking a wave solder machine operation with a test board. Applicability. To be used for new design printed circuit assembles and during machine accept

Re: MicroBGA qualification process

Electronics Forum | Thu Mar 30 21:46:56 EST 2000 | Dave F

Reg: This is copy / paste from draft version of IPC 7095 ( issued May 1999 ) ... 7.3 Assembly accept/reject criteria 7.3.1 Voids in solder joint a. Sources of Voids There can be voids in solder balls, or at the solder joints to the BGA, or at the so

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