Electronics Forum | Mon Aug 30 16:07:06 EDT 2004 | Shean Dalton
Hi Chen, Based on your posted message, the following ideas are for your consideration: "brown residue" The water soluble solder paste you are using could be a water soluble rosin solder paste formulation. Perhaps the solder paste may not be proper
Electronics Forum | Thu Sep 02 15:45:35 EDT 2004 | russ
We don't do any wave, SMT only. We did not have to change apertures for lead free, we use the same stencil that we did when we ran water soluble with pb. This I think might be dependant upon your current design of both pad and apertures however.
Electronics Forum | Tue Sep 14 17:10:54 EDT 2004 | Jeff, jjg6@agere.com
USE JEDEC Specification EIA/JESD22-B102-C Procedure: 1. Stencil print BGA solder paste pattern onto ceramic substrates 2. Carefully and accurately P&P BGA devices onto the dispensed solder paste pattern to avoid smearing the solder paste. 3. R
Electronics Forum | Wed Sep 08 17:49:19 EDT 2004 | gregoryyork
Knock off some balls and you may find it has a flat bottom to it were it has mechanically stuck to the solder resist usually seen under 60X magnification. Common with Liquid photoimageable resist (I know again) Best way to check resist cure is to pay
Electronics Forum | Tue Sep 14 04:42:58 EDT 2004 | rlackey
Hello again Mr Bayram, You will need to do certain tasks to schedule - things like lubrication etc, but these are very simple tasks. But yes, if you are running a lot slower then the major service tasks will be less frequent. One thing I ought t
Electronics Forum | Thu Sep 09 03:57:45 EDT 2004 | svi
Hello, We used FujiCAM to prepare FCM programs but now we're thinking to change it to an other software. We have some FCM and some (more) FUJI machines also. We used FujiCAM to controll and proram the lines but we changed it to Fuji FlexA. Microsof
Electronics Forum | Thu Sep 16 18:59:14 EDT 2004 | Carol
Thanks Everyone, the information was very useful. We use 7095 as a bible. A-610 6.5.3 doesn't allow for any solder balls not entrapped/attached etc. so we will look again at plugging/tenting both ends of the via. We ran into the problem of the mask
Electronics Forum | Thu Sep 23 11:56:30 EDT 2004 | rkevin
We are printing on an assembly using SAC305 Alloy Sn96.5 Ag 3 Cu .5 with a no clean flux and getting virtually NO spread with either a ramp to spike or straight ramp profile. We are printing to standard FR4 board with immersion Ag finish. I am trying
Electronics Forum | Fri Oct 01 13:04:09 EDT 2004 | dorklover664
The company that I work for just bought two new Samsung pick and place machines (CP45FV). I love them. But we are having problems with the vibe stick feeders that we have. They have no groves or slots for the parts so if the tubs move at all the pla
Electronics Forum | Tue Oct 05 20:07:12 EDT 2004 | davef
We do not know how your KIC2000 calculates slope. Here's an approach to calculating slope: * Subtract the lower temperature from the upper temperature. [Temp|upper-Temp|lower] = Temp|change * Subtract the time when the lower temperature was measured
