Electronics Forum | Fri Sep 21 09:29:49 EDT 2001 | steven
when taking a reflow profile, can i attach the thermalcouple to the component body (using high temp tape) instead of to the leads (often found thermal couple dettached during reflow). in general, what is the temp diff between these 2 locatinos. if so
Electronics Forum | Sat Sep 22 09:07:56 EDT 2001 | davef
Back-stepping a bit. If a profile is being used to: * Set-up the oven for a new product or trouble-shooting process, the profile should be taken with a solid contact to a solder connection. * Monitoring on-going stable and in-control process that re
Electronics Forum | Mon Sep 24 17:38:18 EDT 2001 | mparker
First question - do you have a rework station? If so, are you experiencing the same type of failures there? I have successfully used no-clean on uBGA's in the past. 6 mil solder bumps, 10 mil spacing. 88 sites. Are you reusing previously soldered uB
Electronics Forum | Fri Oct 05 08:11:32 EDT 2001 | PeteC
Steven, Batch vs. conveyorized is all about production rate. The conveyorized tend to deliver higher production rates. The conveyor runs at a constant speed. You must use a "profiler" device to establish a recipe for the product you want to solder.
Electronics Forum | Tue Oct 09 14:41:13 EDT 2001 | mparker
I just realized my last posting has some incorrect references. Blame it on last nights sour mash! (St. Pauli girl didn't respond!) The article I referenced was found at the AlphaMetals website, a study done for AlledSignal, in conjunction with Churc
Electronics Forum | Wed Oct 10 20:54:32 EDT 2001 | davef
We're with the Ozzy's earlier posting on this thread. We make similar products, like: * Phantom products that are mostly complete and then are configured to order by adding or subtracting a couple of parts and some jumpers. * Version products like y
Electronics Forum | Tue Oct 16 09:17:10 EDT 2001 | davef
Look at "Microcanyons", Circuits Assembly magazine, December 1998. There D Pauls & T Munson describe adhesive on boards that was cured too rapidly and formed a skin that trapped volatiles and solvents. The volatiles and solvents created long voids i
Electronics Forum | Tue Oct 23 20:12:48 EDT 2001 | dougk
Has anyone has experience using DEK's PumpPrint plastic stencils? We're starting to think about adhesive printing on THT populated boards. These stencils are thick and have undersides routed-out for clinched leads. But, they're plastic, and I'm worri
Electronics Forum | Mon Oct 29 14:52:58 EST 2001 | kjmcbi
We have made a number of step up adhesive stencils using a new material called Cirlex. This material demonstrates excellent release characteristics and is easly cleaned. Typically the glue printing is after the solder printing. The stencil is all las
Electronics Forum | Tue Oct 30 08:55:54 EST 2001 | Stefan Witte
Chris, I should have read your request more carefully. .010" glue dot diameter would require at least .005" needle diameter. No way you can do it with the above mentioned machines. You are already stretching the capability of glue machines for 0402 c
