Electronics Forum: use (Page 1760 of 2489)

Fine Pitch Stencil Design

Electronics Forum | Wed Dec 14 08:06:07 EST 2005 | tk380514

Also we have just made a prototype for Wave soldered SMT components D-packs + 0603 + TSSOP�s on the bottom side with THT comp. on the top, the stencil manufacturer gave his personal library of glue stencil openings and adviced on stencil thickness wh

Mis-align Component

Electronics Forum | Thu Dec 08 11:50:40 EST 2005 | Stefan

If you mention mis-alignment and missing component in the same sentance, I suspect the component is not properly released after placement. Assuming the Juki machines use an air blow, after vacuum shut off, than I would look at a correct air flow firs

Propensity of Immersion Tin surface finish fo whiskers

Electronics Forum | Mon Dec 12 09:39:39 EST 2005 | Amol Kane

thank you devef....My point is this....If you solder all the areas that have Imm Sn on them, there wont be any whisker formation DUE TO THE IMM TIN COATING.....whiskers could still potentially form as a result of COMPONENT FINISHES and effective miti

Screen printer to fit needs

Electronics Forum | Thu Dec 08 16:08:25 EST 2005 | fastek

If you are happy with DEK I would stick with that. I'd look at an ELA or a Horizon model 03...which is their stripped down Horizon version. You can buy a new one of those in the $60K range...used obviously less. The only other vendor I would look a

Microflame vs laser soldering

Electronics Forum | Fri Dec 09 08:24:48 EST 2005 | zanolli

Dear Technetters We have a unique soldering operation that needs automation and we will be evaluating various methods including laser reflow and Spirig�s Microflame. The actual soldering operation entails joing two metal contacts by depositing a sol

Using parts with Tin Bismuth plating in tin lead soldering

Electronics Forum | Mon Dec 12 21:38:05 EST 2005 | davef

Effect of lead on bismuth solders * Lead from hot air leveling (HAL) coatings can diffuse through the grain boundaries of the alloy. * Lead can form a eutectic composition of Bi52Pb32Sn16 in the grain boundaries. * Melting point of this eutectic all

Gold Pads Soldering problem

Electronics Forum | Thu Dec 15 08:04:47 EST 2005 | davef

Snaggie Oxidized nickel is very tough to solder. Using the typical fluxes that are in everyone's fireproof storage cabinet [that they've been sampled by very nice saletypes] is like bringing a knife to a gun fight. Recognize that the flux you want

Gold Pads Soldering problem

Electronics Forum | Fri Dec 16 01:36:53 EST 2005 | tk380514

i would assume when the PCB planner and customer would specify what "surface layer type"they want but this section is always empty but i have found that out yesterday that we only use ENIG and not FLASH GOLD, which is good to know........ but it see

Cover tape tearing

Electronics Forum | Wed Dec 14 22:43:46 EST 2005 | 00629

Im from a semiconductor manufacturing company and we received feedback from customers about cover tape tearing on 16mm heat activated cover tapes...the manifestation of the tear is that it starts from both sides of the seal and continues towards the

Cover tape tearing

Electronics Forum | Thu Dec 15 04:26:20 EST 2005 | Rob

Hi Liza, We tend to see it on the larger plastic tape sizes & lower volume parts - such as smd connectors, fine pitch reeled IC's, BGA's etc. We don't tend to get it on high vol parts such as logic, 8 & 16bit micros, v-regs etc. Could this be du


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