Electronics Forum | Sun Apr 05 18:36:41 EDT 1998 | Graham Naisbitt
Sylvia, I believe you will find that contrary to Scott Cooks submission, that the work carried out by Robert Clark of Hughes Missile Systems at (then) Tuscon Arizona formed the basis of the MIL-F-14256 spec which "Qualified?" or at least "Approved" O
Electronics Forum | Mon Mar 16 20:00:47 EST 1998 | Jon Medernach
| Maybe I'm doing something wrong, but it seems to me that The Forum takes a lot longer to open up now. It also takes a lot longer to get back to the main Forum page, after reading an individual message, and hitting the "BACK" button. What's up? Is
Electronics Forum | Tue Mar 10 03:01:30 EST 1998 | Pete Sorenson
| Cold Welding | I'm presently doing a project on reflow profiling. | I came across this expression. Can someone please give me a definition. | Best Regards | Tom Mc Grath A cold weld is a joint between two metals produced by the application of pr
Electronics Forum | Fri Mar 06 23:09:11 EST 1998 | Scott Cook
| We have a double sided pcb that is surface mount on both sides. Now a Through Hole connector has been added. Appart from hand soldering does anyone have info. on reflow soldering the part. The connector is 0.1mm pitch, square legs. | 1) Do you need
Electronics Forum | Wed Feb 25 17:02:05 EST 1998 | Doug Romm
Just a comment to clarify this discussion. Typically chip caps and other passive components that use palladium plated to the end of the component are very different from the TI nickel/palladium plated IC components (leaded devices). The main di
Electronics Forum | Sun Feb 15 18:07:18 EST 1998 | Scott McKee
| I am beginer in BGA assembly and am confused in selection of pick and place option. As per book on 'implementation of BGA Technology-by 1995 aeic inc. states that BGAs reflow is quite forgiving and you need only Mechanical centering of PBGAs. The I
Electronics Forum | Sat Feb 14 13:33:10 EST 1998 | ashok dhawan
| I am beginner in BGA assembly and am confused in selection of centering method on pick and place operation.. As per book on 'implementation of BGA Technology-by 1995 aeic inc. states that BGAs reflow is quite forgiving and you can use Mechanical c
Electronics Forum | Mon Jan 12 14:07:53 EST 1998 | Yves Trudell
I've heard of a series of labels that absorb moisture at different rates and/or change appearance when a specific saturation level is reached. If such labels exist and if they could be correlated to the exposure limits of specific moisture sensitivit
Electronics Forum | Mon Jan 12 13:15:18 EST 1998 | Yves Trudell
In general terms, guidelines for moisture sensitive devices (MSDs) say that you shouldn't put a component through reflow after it has reached its exposure limit with respect to moisture absorption. When using an automated hot air rework tool to remo
Electronics Forum | Wed Dec 10 14:03:56 EST 1997 | Scott Cook
| I would appreciate hearing views on vapour phase soldering particularly in respect to BGA's. | I know that they used to use CFC's but apparently this is no longer the case? | Can anyone help with some info? | Thanks, Alan Brewin Alan, Unfortunately
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