Electronics Forum: used (Page 1123 of 2500)

Re: Water Soluable Flux for Military

Electronics Forum | Sun Apr 05 18:36:41 EDT 1998 | Graham Naisbitt

Sylvia, I believe you will find that contrary to Scott Cooks submission, that the work carried out by Robert Clark of Hughes Missile Systems at (then) Tuscon Arizona formed the basis of the MIL-F-14256 spec which "Qualified?" or at least "Approved" O

Re: In the UK they pay for TV

Electronics Forum | Mon Mar 16 20:00:47 EST 1998 | Jon Medernach

| Maybe I'm doing something wrong, but it seems to me that The Forum takes a lot longer to open up now. It also takes a lot longer to get back to the main Forum page, after reading an individual message, and hitting the "BACK" button. What's up? Is

Re: Cold Welding Phenomenon

Electronics Forum | Tue Mar 10 03:01:30 EST 1998 | Pete Sorenson

| Cold Welding | I'm presently doing a project on reflow profiling. | I came across this expression. Can someone please give me a definition. | Best Regards | Tom Mc Grath A cold weld is a joint between two metals produced by the application of pr

Re: Any help reflow soldering Through Hole parts

Electronics Forum | Fri Mar 06 23:09:11 EST 1998 | Scott Cook

| We have a double sided pcb that is surface mount on both sides. Now a Through Hole connector has been added. Appart from hand soldering does anyone have info. on reflow soldering the part. The connector is 0.1mm pitch, square legs. | 1) Do you need

Re: Soldering to Palladium vs. Tin_Lead plated comps

Electronics Forum | Wed Feb 25 17:02:05 EST 1998 | Doug Romm

Just a comment to clarify this discussion. Typically chip caps and other passive components that use palladium plated to the end of the component are very different from the TI nickel/palladium plated IC components (leaded devices). The main di

Re: BGAs centering method

Electronics Forum | Sun Feb 15 18:07:18 EST 1998 | Scott McKee

| I am beginer in BGA assembly and am confused in selection of pick and place option. As per book on 'implementation of BGA Technology-by 1995 aeic inc. states that BGAs reflow is quite forgiving and you need only Mechanical centering of PBGAs. The I

Re: BGAs centering method

Electronics Forum | Sat Feb 14 13:33:10 EST 1998 | ashok dhawan

| I am beginner in BGA assembly and am confused in selection of centering method on pick and place operation.. As per book on 'implementation of BGA Technology-by 1995 aeic inc. states that BGAs reflow is quite forgiving and you can use Mechanical c

Moisture Sensitive Devices - Absorption Labels

Electronics Forum | Mon Jan 12 14:07:53 EST 1998 | Yves Trudell

I've heard of a series of labels that absorb moisture at different rates and/or change appearance when a specific saturation level is reached. If such labels exist and if they could be correlated to the exposure limits of specific moisture sensitivit

Thermal Conditions Causing damage to MSDs

Electronics Forum | Mon Jan 12 13:15:18 EST 1998 | Yves Trudell

In general terms, guidelines for moisture sensitive devices (MSDs) say that you shouldn't put a component through reflow after it has reached its exposure limit with respect to moisture absorption. When using an automated hot air rework tool to remo

Re: Vapour Phase Soldering

Electronics Forum | Wed Dec 10 14:03:56 EST 1997 | Scott Cook

| I would appreciate hearing views on vapour phase soldering particularly in respect to BGA's. | I know that they used to use CFC's but apparently this is no longer the case? | Can anyone help with some info? | Thanks, Alan Brewin Alan, Unfortunately


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