Electronics Forum | Thu Sep 24 07:43:12 EDT 1998 | Earl Moon
| does anyone know what exactly the term "characterization of a machine" means?i need to characterize a flip chip bonder which has the capacity to mount the dies on substrates not more than 2" x 2" size.please respond asap. Characterization means det
Electronics Forum | Tue Jul 18 16:49:49 EDT 2023 | mahasg
Hello All, I am PhD student at polytechnique Montreal. We have a CQFP44 packages and Dies of 51um pad pitch (22nm FDSOI tech) that I need to bond myself at the university using ASM Eagle Xtreme gold wire bonder in the university. we need to perform b
Electronics Forum | Fri Aug 17 01:40:55 EDT 2001 | V.RAMANAND KINI
We are in the watch & clock Business. We have a Watch IC chip that has to be wirebonded using Ultrasonic aluminium wedge bonder. The wire dia is 1.25mil. The PCB is made of G10 Glass epoxy copper clad laminate. The copper thickness is 18 microns. The
Electronics Forum | Tue Jan 30 17:58:49 EST 2007 | flipit
Hi, I would not be too concerned about what the shape of your wirebonding fiducial is. Cross, Square, Diamond, Circle, will all work well for you. I use a "+" and a diamond. Your machine magnification will be great, so don't make the fiducials to
Electronics Forum | Wed Mar 10 15:45:24 EST 2010 | flipit
Looking for a large area wire ball bonder or wedge bonder. Must be able to take 4" X 5" panel and have a bond area of close to 3.5" X 4.4". Also need 6 to 8 wire per second. K&S no longer makes one. Panasonic no longer makes one. ASM does not mak
Electronics Forum | Wed Jan 31 17:30:54 EST 2007 | GS
Thanks a lot flipit, I am not directly involved in this "problem" but is my friend that have his CM rejecting PCBs because it says the "+" mark (spokes lengths) are out of tolerances. It seams CM bonder's require tolerance +/- 0,05(? not sure). I d
Electronics Forum | Tue Mar 16 20:45:51 EDT 2010 | r_nelson777
check out DIAS in HongKong. They may have what you need. website. http://www.diasautomation.com email. sales@diasautomation.com
Electronics Forum | Tue Mar 16 18:36:11 EDT 2010 | janz
Looking for a large area wire ball bonder or > wedge bonder. Must be able to take 4" X 5" panel > and have a bond area of close to 3.5" X 4.4". > Also need 6 to 8 wire per second. K&S no longer > makes one. Panasonic no longer makes one. ASM
Electronics Forum | Tue Jun 05 15:56:22 EDT 2007 | adlsmt
Can you use a 4682 fine pitch bonder?
Electronics Forum | Thu Jul 04 23:17:24 EDT 2019 | 123456789
Today we will talk some other problems you may meet in the wedge bonding work. If you have any other supplement or suggestion, welcome to leave us message. Appear welding spot indentation on the frame, what's the causes? How to solve? 1.The Wedge’s
