Electronics Forum: vacuum baking oven (Page 1 of 42)

Moisture Sensitive part - baking

Electronics Forum | Sat Aug 25 08:39:15 EDT 2007 | gsala

If plastic Carrier Tape (CT)/ emboss tape, is made by: a)Polycarbonate material, it can withstand temperature around 120C� or may be more mantaining original dimension. b)Polystirene material, at max 45�C-50C� the CT starts to change dimensions and

component baking

Electronics Forum | Wed Aug 21 07:24:12 EDT 2002 | bayanbaru

What is the correct method to bake or cure the component?Standard baking practise by us is to place the units into oven at 125 �C for 8 hrs directly. But I was told that the correct baking practise is to cool down the Baking Oven to Room temp and onl

component baking

Electronics Forum | Fri Aug 16 18:23:48 EDT 2002 | kenbliss

Hi Dave Interesting points. If I understand you correctly 1. about 2% of part numbers have a moisture problem 2. Packaging frequently comes in with expired dates on them. This seems hard to believe you would accept them. 3. To really solve the

vacuum reflow

Electronics Forum | Wed Apr 21 19:32:13 EDT 2021 | davef

Here's some information about Fred Dimock's work on vacuum reflow - Operation of a Vacuum Reflow Oven with Void Reduction Data [ https://smtnet.com/library/index.cfm?fuseaction=view_article&article_id=3336&company_id=40492 ]

PCB & MSD Component baking oven

Electronics Forum | Fri Dec 03 05:32:03 EST 2010 | libandara

Dear Graham, Thanks for the information. is there any way to control the humidity inside the oven..? At over 100 C. how the evaporated vapour from the component remove out from the oven..?

PCB & MSD Component baking oven

Electronics Forum | Tue Dec 07 07:26:50 EST 2010 | grahamcooper22

In an oven over 100 C any moisture will escape through vents. There will not be huge volumes of moisture in the oven when you are baking components so it should easily escape through vents / holes in the system leaving you with a humidity of near zer

PCB & MSD Component baking oven

Electronics Forum | Tue Nov 30 02:46:21 EST 2010 | libandara

We want to handle the materials such as PCB & MSD components as per IPC 1601 & J-STD-033. As such, we need a baking oven to perform this and to monitor (temperature – we have to maintain up to 200’C & humidity – below 5%)the control environment & ma

PCB & MSD Component baking oven

Electronics Forum | Fri Dec 03 04:11:47 EST 2010 | grahamcooper22

A baking oven over 100 C will be at zero humidity. Do you really need to store pcbs/devices at 200 C...this will surely harm some products ? IPC 33B01 allows storage of MSDs in a dry cabinet at less then 5%.....these can operate at room temp or 40 /

component baking process

Electronics Forum | Mon Sep 20 16:06:53 EDT 2004 | blnorman

We require that the ovens used for bake out are vented, thus removing the vapor from the oven.

component baking process

Electronics Forum | Sun Sep 19 19:51:31 EDT 2004 | aaronrobinson

thanks for your reply ....yes the air is then able to hold more water vapour.... but so is the component hence there is no water vapour pressure difference and the component and the air in the oven would still be in equilibrium???? hence no effective

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