Electronics Forum | Wed Mar 15 13:38:12 EDT 2023 | emeto
Did you try clean them or place brand new nozzles to see if error goes away?
Electronics Forum | Fri Sep 01 09:54:02 EDT 2017 | gsmx4321
I get a Timeout waiting for nozzle changer vacuum buildup failure every time I go to run my 1998 GSMx machine. The problems seems to be that once in a while (it seems to be random) the spindle does not line up exactly in the center of the nozzle cha
Electronics Forum | Thu Oct 01 16:46:50 EDT 1998 | Dave F
We are trying to eliminate/minimize the baking process for high lead-count ICs. We would like to reseal packages containing these parts to minimize exposure to humidity. Anyone have or know of a way to reseal or vacuum pack parts? Any suggested eq
Electronics Forum | Mon Nov 10 14:26:16 EST 2008 | slthomas
It'll just transfer the load to your compressor, and who knows how efficient your venturi pump (which can also be noisy) will be (IOW, how much load it puts on your compressor is anyone's guess)? I'd just replace or rebuild the vacuum pump, person
Electronics Forum | Mon Nov 10 13:27:07 EST 2008 | evtimov
Hi janz, you should be aware of everything. You are going to change subsystem on your machine. How much vacuum you need on the machine? Can you control the vacuum level with your system? Can you control the the system at all? Is it really much more
Electronics Forum | Wed Jan 30 08:27:37 EST 2019 | mst3000
Hi there. We are facing an issue with the placing head of our SMT machine SIEMENS SIPLACE CF 2004 model where the vacuum reading is low (820 instead of 900). This is resulting in that the components are either falling off when the head moves onto the
Electronics Forum | Tue Feb 15 00:27:39 EST 2011 | jeffr
First clean and de-bur the hole in the nozzle, then try it again. If the Head does not pick up at the feeder, then moves to the dump position...it means that the Vacuum Sensor Board has detected that the nozzle vacuum is above the LOW threshold setti
Electronics Forum | Mon May 06 11:45:32 EDT 2019 | slthomas
There are quite a few papers out there on the subject. Just enter "SMT void reduction" into google or other search engine and take your pick. That said, slow ramp rates and paste volume reduction are a good place to start. Although I haven't tried i
Electronics Forum | Thu May 30 09:33:15 EDT 2019 | emeto
Contributors in order of importance: 1. PCB design - if you have large thermal pads, a grid of via holes should be created. Components with low profile will not let the gas to escape from the joint. The only way is going down. 2. Reduce paste volum
Electronics Forum | Wed Oct 30 09:43:01 EST 2002 | gregp
Larger tighter spaced balls will present a problem in sealing the vacuum cup. There will be more leakage in this case. It really depends upon the application. The BGA you mention should not be a major concern. The bigger problems are with bigger
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