Electronics Forum | Thu Oct 04 00:03:28 EDT 2018 | gaintstar
flason smt pick and place machine: http://www.flason-smt.com/product/Hanwha-IC-placer-SM321-High-Speed-SMT-Modular-Chip-Mounter.html http://www.flason-smt.com/product/Hanwha-Pick-and-Place-Machine-DECAN-F2-High-Speed-SMT-Modular-Chip-Mounter.html htt
Electronics Forum | Tue Jul 18 03:52:57 EDT 2000 | Jeff Sanchez
Dave, I will take a stab at this. Haveing not had the opertunity to be stuck in such a jam. I would take a piece a aluminum and cut out a whole the size of the shield.The aluminum plate should be the size of the board or larger. Use stand offs to
Electronics Forum | Thu Jan 27 20:34:12 EST 2000 | Dave F
Ashok: The real concern about moisture sensitivity is in plastic packaged parts. The plastic packaging used to manufacture surface mount technology devices absorb moisture from the environment. The high temperatures involved in vapor phase/reflow
Electronics Forum | Thu Sep 02 13:01:51 EDT 1999 | John Thorup
| | Certain ICs cannot be place by our pick and place machines and therefore operators place them by hand. Has anyone seen some type of dispensing material handler that would ensure we don't bend the leads of this fragile devices? I'm envisioning som
Electronics Forum | Thu Jun 25 09:37:48 EDT 1998 | Russ Miculich
The real causes of microcracking are not normally due to pick and place - particularly if you are using a piece of equipment with vacuum pick up and release. The real cause of microcracking is due to thermal stresses on the die and the choice of the
Electronics Forum | Tue Aug 24 15:10:14 EDT 1999 | Ian T
| | | | | Hello everyone, | | | | | We found many cylindrical diodes missing during SMT process. Could someone tell us how to prevent this problem? Is it effective to change the shape of stencil apture or reduce fan speed in reflow oven? Thanks in ad
Electronics Forum | Wed Aug 25 01:25:49 EDT 1999 | Gyver
| | | | | | Hello everyone, | | | | | | We found many cylindrical diodes missing during SMT process. Could someone tell us how to prevent this problem? Is it effective to change the shape of stencil apture or reduce fan speed in reflow oven? Thanks i
Electronics Forum | Sun Apr 25 04:12:34 EDT 1999 | Earl Moon
| At Sanders (Military manufacturer), we have only started using plastic parts within the past few years. After being tasked with reviewing the new J-Std-033, it became obvious to me our process for controlling device exposure is weak. We build very
Electronics Forum | Mon Sep 17 15:27:51 EDT 2001 | jschake
Challenges: The basic defects that impact assembly yield are bridging, satellite solder balls, and opens (i.e. tombstones / draw bridges). There are many variables with the stencil printing process that can impact these; several of them are listed
Electronics Forum | Wed Feb 16 21:51:29 EST 2000 | Dave F
Kurt: Lots of choices, not many of them good, yano. 1 So LPI has taken over the market pretty nearly 100%, but it won't "tent" reliably, because it is not very viscous when applied and drops into the hole. So then, tenting/plugging with LPI is bad
