Electronics Forum | Mon May 02 17:16:02 EDT 2011 | pbiron
We have recently started up a vapor phase machine and no body can tell me what an ideal profile should look like. I preheat the board about 10 degrees lower than the melting point of the solder paste. The joints look great! Just have no documentation
Electronics Forum | Tue Apr 02 14:24:35 EDT 2013 | hegemon
Too many hands in the bucket, unless the owner is one of the engineers. Typically flux is not rated or classified by "feel". What are you soldering? Wires? Components to PCB? What is your cleaning capability or requirement? Aqueous? No-Clean? Ul
Electronics Forum | Wed Jun 18 01:47:25 EDT 2008 | sleech
Innovative Drying Co., considered this possibility early in our experiments. The rate of chamber pump-down is not a consideration. However, the selection of the vacuum pump is critical. Avoid oil-sealed pumps at all costs. A poorly maintained oil-tra
Electronics Forum | Mon Feb 19 14:17:21 EST 2001 | bschreiber
Hi Mark, If you are a user of stencils, you already know that there are literally hundreds of stencil manufacturers out there. If you found one that will allow such hot temperatures, I would be interested in learning who it is. However, I have only
Electronics Forum | Mon Oct 21 22:15:36 EDT 2002 | davef
First, SIR data is heavily dependant on the test pattern selected. Be very careful when comparing the results of resistance readings taken from different geometric patterns. Second, if yer talkin': * Bare boards, yupper. * Finished assemblies impor
Electronics Forum | Fri May 02 09:37:23 EDT 2003 | Jerry Magera
Via in pad is the most efficient use of space. Blind via seems to be blamed for this. Cross-sections (send me some) will probably show a void still existing in the via or spherical voids aligned near the component pad side. One can estimate the vo
Electronics Forum | Wed Jun 09 17:29:59 EDT 1999 | Earl Moon
| I am starting a new project which involve 3 oz copper layer with 20 mil components on the top of the board and 0.040" thick copper with D2Pak on the bottom of the board. | There is anybody has experience on metal-based PCB reflow process? I guess
Electronics Forum | Thu Jun 10 11:23:10 EDT 1999 | Gang Pan
| | I am starting a new project which involve 3 oz copper layer with 20 mil components on the top of the board and 0.040" thick copper with D2Pak on the bottom of the board. | | There is anybody has experience on metal-based PCB reflow process? I g
Electronics Forum | Thu Aug 21 09:05:07 EDT 2003 | davef
Use a cartridge that's approved [conform to OSHA 42 CFR 84] to provide respiratory protection against organic vapors, chlorine, hydrogen chloride, sulfur dioxide, chlorine dioxide, and hydrogen fluoride with a P100 particulate filter which is effecti
Electronics Forum | Wed May 12 13:34:02 EDT 2010 | hegemon
Thanks Pete B - great info. I am currently preparing a DOE to address concerns about reflow of componentry on the bottomside of the PCB while in the vapor. Specifically cosmetics and part dropping. Bottom side has no flux, but will be fully reflow
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