Electronics Forum | Fri Oct 01 14:16:15 EDT 1999 | Rick
I know there are a ton of variables that affect the overall height of a BGA after soldering to a PWB but... I'd like to know if anyone has done an analysis of (or if it's documented) as to what the pre and post reflow height dimension as measured fr
Electronics Forum | Fri Apr 06 08:35:20 EDT 2001 | brownsj
You can buy plenty of paste height measuring systems today, ranging from full 3D laser systems to systems using an oblique light line which will measure the paste height only. I found that the lowest cost option was to attach a DTI to the focus contr
Electronics Forum | Tue Mar 16 14:37:42 EST 1999 | Steve Gregory
Hi Nancy! Just as Steve and Dean said, most printers have some sort of restrictions of what frame, where the image is positioned, ect. before the stencil will work in the printer. The two manufacturers that I'm most familiar with DEK and MPM do have
Electronics Forum | Tue Mar 13 16:05:30 EST 2001 | rob_thomas
Hi, can you definitely attribute the 30%yield to poor bga soldering? What is your high flyer defect encountered on the failed boards.Is this ICT ,flying probe ,functional test yield? Can you determine a defect pattern? Did your subcontractor provided
Electronics Forum | Thu May 10 10:33:46 EDT 2001 | Eyal Duzy
Genny, I would like to correct part of the things that you were told. As far as I know, X-Ray tools are not positioned as tools to find solder volume simply because it is not a strong point for them. An X-Ray image is either a projection (2D transm
Electronics Forum | Mon May 28 07:30:52 EDT 2001 | bobwillis
Here is a draft visual inspection guide for underfill, please pass this on to the relevant people for any comments or suggestions. I am currently working on the pictures to go with the reference guide. Flip Chip/uBGA Underfill Visual Standards The
Electronics Forum | Wed Jul 27 09:58:05 EDT 2011 | davef
Pressure printing systems Conventional stencil printing techniques have fundamental limitations as regards paste handling: The volume of paste available for printing is limited, so frequent replenishment is necessary Paste is difficult to c
Electronics Forum | Tue Jun 05 03:56:52 EDT 2001 | JohnW
Flip Chip/uBGA Underfill Visual Standards The aim of this document is to produce some draft text and then select photographs to make up a draft visual standard for inspection. There is also a need to produce some reference material for C Scan image
Electronics Forum | Thu Jan 14 15:22:14 EST 1999 | Earl Moon
| Steve, | Whoa, take a breath! That was at least a dollar three-eighty answer. I've got to agree that nothing can replace a qualified, concientious operator for assuring quality. When I too worked at a small shop there in SillyCone Valley, my
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