Electronics Forum: variation (Page 12 of 39)

Component ( Connector ) drop during secondary reflow

Electronics Forum | Tue Dec 04 02:58:44 EST 2018 | robl

I would guess then that it is either variation in paste volume (unless you are using an inline SPI), or potentially a damaged chain or sprocket causing a small jump. The second one is easy as you can watch the chain do a full rotation, the first a b

Component ( Connector ) drop during secondary reflow

Electronics Forum | Wed Dec 25 02:42:15 EST 2019 | sssamw

Yes, the barycenter causes drop off since only leads at one side, so a variation of re-flow oven, such as vibration or hot air flow, low re-flow time could help a little. So, how you solve this issue after many months?

Load Cell Temperature

Electronics Forum | Sat Jun 29 18:59:43 EDT 2019 | davef

You weren't clear on the type of gauge that you're using. Strain gauge load cells are the most common. These load cells have two gauges. The orientation of the gauges affects cell performance characteristics. * Temperature compensated: Temperature

Conformal Coating Process Control & Inspection

Electronics Forum | Fri Aug 07 16:40:31 EDT 2020 | duso02

There is too much variation in the different Conformal Coating types and application requirements that you will get many different answers. Your controls will be tailored to the job requirements. My controls for parylene coating aerospace product is

What is the issue?

Electronics Forum | Fri Aug 07 20:07:16 EDT 2020 | emeto

Based on datasheet you can have balls with significant variation(twice volume) 0.13Sqr/0.19sqr = 0.46 I would suggest you tighten the machine recognition control. You will recognize BGA balls that are very different in size and reject the part. This

power grid quality for SMT line

Electronics Forum | Mon Nov 29 15:09:24 EST 2021 | saberbouras

Hi, I have experienced the same troubleshoots for our machines and computers, accroding to the expert who did the harmonics study our problem is created by the intense use of UPS, lights yes lights. The resultant high frequency variation in sinewave

Reflow oven profiles

Electronics Forum | Mon Nov 27 22:01:57 EST 2023 | emeto

It is about thermal mass and heat dissipation. If you want to be accurate, you should profile each one. If you want to be efficient, You should design all panels to come to the same size. This way variation from panel to panel will be minimal (given

Reflow oven profiles

Electronics Forum | Thu Nov 30 10:05:02 EST 2023 | jineshjpr

All depends on how accuracy you require -- Incase if the PCB layers are same along with same solder paste uses -- pls segregate as batch in terms of similar pcb dimension ( within 30cm variation) attach thermo couples to maximum area -- May be you ne

Re: Screen Printer Visual Inspection Equipment

Electronics Forum | Fri Dec 17 16:25:05 EST 1999 | Brian W.

I used an off-line paste height measurement device to control my paste process. I did not inspect every board, just a random sample once an hour. I have used both manual and automatic devices. I like the automatic becuase: 1 - I have no "operat

Re: Print Height Variation

Electronics Forum | Thu Feb 11 09:45:06 EST 1999 | Dave F

| | | Helo, | | Is it common for actual print height of solder paste to exceed the stencil thickness. For example If the stencil is 6mill thick and the actual height of the print is apx. 10 or 11mill. What causes the paste height to be greater t


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