Electronics Forum | Thu Jan 12 14:17:07 EST 2012 | blnorman
How are the vias failing? Barrel crack?
Electronics Forum | Mon Jul 08 11:53:40 EDT 2002 | yngwie
Hi Guys, We prints solder paste on via hole as the holes are used as the test points. This is a clean process. In normal production, upon completion of a primary side, board will proceed to secondary process immediately. The problem happened when
Electronics Forum | Thu Sep 02 15:51:15 EDT 2004 | cburress
All: IPC does not directly state any criteria for physical characteristics of what a filled via should look like when embedded within a surface mount component's pad. I am using several of these in my design, and have received PCBs that exhibi
Electronics Forum | Wed Sep 27 12:44:52 EDT 2000 | Ashok Dhawan
What could be possible resons for " Plating Crack on Barrel (tented via)" This tented via is in proximity to parts being hand soldered. The crack in barrel was detected on failure analysis - micro-section of via where barrel is having crack ( circul
Electronics Forum | Mon Jun 05 14:17:18 EDT 2000 | C.K.
Dream: Yes, VIA's are connected to actual SMD pads via traces - roughly .030" from the pad. The VIA is .013" in diameter, and the excess solder bleeds out of the actual VIA barrel after the 1st reflow.... -CK
Electronics Forum | Wed Sep 27 19:37:32 EDT 2000 | Dave F
Wolfgang is correct. Copper plating thickness of the via barrel walls is a key question you need to answer to troubleshoot this. Tenting is a red herring.
Electronics Forum | Sat Jun 03 00:14:04 EDT 2000 | Ramon I Garcia C
Hi I don't speak english very well but some time I had A similar problem but the diference that we only procesed a single side, my pcb have one via hole barrel close to the pad then the solder flow throu the hole, my problem was an insuficient solder
Electronics Forum | Sun Dec 15 22:31:43 EST 2002 | craigj
Has anyone heard of vias cracking (barrel from pad) when being wave soldered. Was told this was a big problem by contract pcb designer, he always tent vias because of this. The reason was that the solder filling the vias caused stressing and then sep
Electronics Forum | Fri Jan 25 19:01:35 EST 2013 | hegemon
My first guess is that the plating in the barrel (via) has failed and allowed laminate/epoxy egress into the barrel and out to the surface of the board. Just a guess based on the picture.... 'hege
Electronics Forum | Wed Jan 02 01:30:38 EST 2002 | Dreamsniper
Hi Guys, What most of you do with the above cert. of conformance that comes on a certain batch of PCB's from the PCB manufacturers ? It also comes with a micro section of a PCB showing the internal of a PTH Via Barrels. I kept receiving them from ev
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