Electronics Forum | Thu Jan 07 09:44:57 EST 2010 | cbart
What material is used to cap a via? Is it the standard LPI Process/Material?
Electronics Forum | Wed Jan 27 20:11:36 EST 2010 | plerma
What material is used to cap a via? Is it the > standard LPI Process/Material? we tent vias all the time, mostly to assist with assembly and the majority of the time outgassing is not a problem. What is the purpose in your case?
Electronics Forum | Mon Jan 11 14:48:44 EST 2010 | davef
SR1000 is commonly used for tenting. Search the fine SMTnet Archives on : tenting Someone gave us this note. We have lost their name. It seems to be good advice. If Liquid Photo Image (LPI) solder mask is required, do not tent via holes. Tenting
Electronics Forum | Thu Sep 24 09:28:13 EDT 2015 | rgduval
No direct experience with this particular issue....but, I do know that measuring capacitance can be tricky. How are you arriving at this conclusion? Are you measuring the caps on the bench before assembly, and then on the boards post assembly? Cap
Electronics Forum | Fri Nov 03 07:28:27 EST 2006 | davef
Via filling methods are: * Tenting * Plugging * Capping * Flooding Tented Via. A via covered with dry film soldermask; the via is not filled. When tenting from both sides there may be issues with trapped air that expands during mass soldering. Plug
Electronics Forum | Tue Oct 15 15:16:34 EDT 2002 | Abelardo Rodriguez Santana
We run into that issue all the time. If a corrective action must be done right away. Place Kapton tape on the bottom side of the board to cap off the via. If you have room to place tape if not use pink lady or something to plug the via. And weathe
Electronics Forum | Wed Jun 01 15:50:59 EDT 2011 | markhoch
I don't believe that particle size of the solderpaste will offer you any relief from this issue. The solder flows into the via, leeching away from the desired solderpoint, after the solder has become liquious. The chemical make-up of the solder contr
Electronics Forum | Thu Aug 15 15:58:12 EDT 2002 | robertnguyen
To whom this may concern, I recently ran into the problem with vias on pads of BGA when place BGA and reflow gas trap on vias escape and result in ball having void greater than 50% of BGA diameter. The BGA pad is measured at 20 mils and the vias mea
Electronics Forum | Sun Dec 25 18:54:04 EST 2005 | mariss
We are experiencing fracture problems with 0805 X7R capacitors. The capacitors seem to fail in tension; during hot-air rework they come apart in two pieces with the fracture near the metallization end. Only X7R SMT components are affected, C0G and Y
Electronics Forum | Sun Dec 15 22:31:43 EST 2002 | craigj
Has anyone heard of vias cracking (barrel from pad) when being wave soldered. Was told this was a big problem by contract pcb designer, he always tent vias because of this. The reason was that the solder filling the vias caused stressing and then sep
