Electronics Forum | Thu Nov 14 09:24:07 EST 2002 | joconnell
What about when debugging the board I recently saw a case where we damaged a board between - 5-10 cycles of the fixture It's a catch 22 - where you need high force probes to breal the OSP - but the copper is hard surface, not like the solder HASL a
Electronics Forum | Mon Jan 18 20:51:29 EST 1999 | Dave F
| Can anyone recommend ways of reducing damage to solder masks ... a new wick perhaps. I find that using standard wicks the imposed damage is un-acceptable. | | Also any good links on the subject of bga rework would be really appreciated | | in ear
Electronics Forum | Wed Sep 15 22:52:58 EDT 2004 | pdeuel
We had same problem. Solder balls appeared on top side of board and led to damaged second side stencles. We worked around problem by running blank boards thru oven and inspecting and removing solder before processing boards with parts.
Electronics Forum | Thu May 21 22:07:47 EDT 1998 | Mike Konrad
I am a former employee of a drag soldering machine manufacturer. For years they attempted to devise a method of soldering surface mount devices via the drag soldering machine. Bridging was the largest problem along with component damage due to exce
Electronics Forum | Fri May 22 22:13:27 EDT 1998 | G. Henning
Thanks for the advice. We are experiencing only limited success with SMT on the drag. Problems are indeed bridging and misses on the smaller discretes. Works well on PTH as long as the pitch is not too tight. I'll have to justify a new machine. Rega
Electronics Forum | Thu May 21 22:20:18 EDT 1998 | Earl Moon
| I am a former employee of a drag soldering machine manufacturer. For years they attempted to devise a method of soldering surface mount devices via the drag soldering machine. Bridging was the largest problem along with component damage due to ex
Electronics Forum | Wed Feb 14 21:14:45 EST 2001 | davef
BGA Shorting 1 Damaged mask in between the BGA pad and via on the substrate. 2 Poor print registration. 3 Poor via segregation from the pads? Are they tented or is there just a dam in between? 4 Review the profile. You can run into a number of p
Electronics Forum | Mon Mar 15 16:07:32 EST 1999 | Earl Moon
| | After rmoving a BGA (plastic)to correct unexplained shorts | | I installed another BGA using flux only. | | Checking on an X Ray machine and found two shorts. | | | | can anyone give a good explenation ? | | | | Thanks | | | | Ron | | | Ron,
Electronics Forum | Thu Nov 14 05:45:51 EST 2002 | Jon O'Connell
Has anyone had experiences of ICT test fixtures actually damaging the PCB boards - typically when they have moved away from HASL finish to OSP. I would also like to hear more about any specific issues seen at ICT for non HASL pcb finishes thanks -
Electronics Forum | Wed Nov 07 17:11:14 EST 2001 | davef
1 CAN WAVE SOLDER AFFECT OR DAMAGE BGA? Sure. Since you are vague, assuming: * Partially assembled board was not stored to prevent moisture absorption. * BGA is in a plastic package. * Partially assembled board was stored long enough to exceed th
