Electronics Forum: via hole (Page 1 of 44)

via hole plugging

Electronics Forum | Wed May 19 11:50:32 EDT 1999 | Chris Nuttall

We care currently running into problems during our plug via process: At the moment we plug prior to soldermask (LPISM) using epoxy resin - plugging takes place from the component side - however we are seeing solderballs after solder level.This is cau

Re: via hole plugging

Electronics Forum | Wed May 19 13:13:20 EDT 1999 | Dave F

| We care currently running into problems during our plug via process: | At the moment we plug prior to soldermask (LPISM) using epoxy resin - plugging takes place from the component side - however we are seeing solderballs after solder level.This is

Re: via hole plugging

Electronics Forum | Thu May 20 07:53:55 EDT 1999 | Chris Nuttall

| | We care currently running into problems during our plug via process: | | At the moment we plug prior to soldermask (LPISM) using epoxy resin - plugging takes place from the component side - however we are seeing solderballs after solder level.Thi

Bigger particle size solder paste helps reduce via hole problem?

Electronics Forum | Wed Jun 01 00:25:28 EDT 2011 | alcatel

I have one pcb which has via holes on both solder pads of 0402 chips. Right now im using type 3 solder paste with 45 degree squeegee. and a lot of these chips are tombstoning. Im guessing with larger particle size of solder paste, the solder will

solder pop out from via hole at secondary reflow

Electronics Forum | Mon Jul 08 11:53:40 EDT 2002 | yngwie

Hi Guys, We prints solder paste on via hole as the holes are used as the test points. This is a clean process. In normal production, upon completion of a primary side, board will proceed to secondary process immediately. The problem happened when

Dealing with BGA solder ball in via hole

Electronics Forum | Thu Mar 24 16:53:53 EDT 2011 | davef

Can you jumper the via to the pad?

Bigger particle size solder paste helps reduce via hole problem?

Electronics Forum | Thu Jun 02 07:27:11 EDT 2011 | scottp

You need to post a picture or describe your geometry better. Is this a through hole via in pad or is the via offset from the pad with no soldermask in between?

solder pop out from via hole at secondary reflow

Electronics Forum | Tue Jul 09 00:11:42 EDT 2002 | yngwie

Thanx Dave F.

Dealing with BGA solder ball in via hole

Electronics Forum | Thu Mar 24 15:58:52 EDT 2011 | davef

Just build-up the boards and ship them. Be sure to inform your customer about the problem that you have with their design and ask that the via be filled and plated over to prevent the problem in the production runs.

Dealing with BGA solder ball in via hole

Electronics Forum | Thu Mar 24 18:05:54 EDT 2011 | nkinar

That's really interesting, davef. How would I jumper the via to the pad? Could you elaborate?

  1 2 3 4 5 6 7 8 9 10 Next

via hole searches for Companies, Equipment, Machines, Suppliers & Information

pressure curing ovens

Software for SMT placement & AOI - Free Download.
thru hole soldering and selective soldering needs

Training online, at your facility, or at one of our worldwide training centers"
High Throughput Reflow Oven

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...
SMT feeders

Easily dispense fine pitch components with ±25µm positioning accuracy.
Hot selling SMT spare parts and professional SMT machine solutions

Thermal Transfer Materials.