via holes need to close in stencil - SMT Electronics Manufacturing

Electronics Forum: via holes need to close in stencil (Page 1 of 1)

Voiding in board to BGA joints

Electronics Forum | Tue Mar 09 07:51:12 EST 2004 | Bryan

Hello everyone: 1.I use Kester R244 63/37 solder paste. 2.Stencil thickness 6 mil. 3.Springdale Chipset. 4.PCB finish:HASL 5.Profile:Peak temp.:210~220C,time above 183C:60~90 seconds,time between 150~183C 60~90 seconds. 6.Reflow oven:Heller 1800 Voi

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Electronics Forum: via holes need to close in stencil (Page 1 of 1)

Voiding in board to BGA joints

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