Electronics Forum: via relief (Page 1 of 2)

Bigger particle size solder paste helps reduce via hole problem?

Electronics Forum | Wed Jun 01 15:50:59 EDT 2011 | markhoch

I don't believe that particle size of the solderpaste will offer you any relief from this issue. The solder flows into the via, leeching away from the desired solderpoint, after the solder has become liquious. The chemical make-up of the solder contr

Providing Thermal Relief On Vias

Electronics Forum | Wed Jun 03 13:51:57 EDT 1998 | Dave F

Hello: BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold joints, opens

Re: Providing Thermal Relief On Vias/Like A Wagon Wheel??

Electronics Forum | Wed Jun 03 21:40:38 EDT 1998 | Dave F

| | Hello: | | BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold joints

Re: Providing Thermal Relief On Vias

Electronics Forum | Wed Jun 03 14:17:12 EDT 1998 | Earl Moon

| Hello: | BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold joints, op

Re: Providing Thermal Relief On Vias

Electronics Forum | Wed Jun 03 18:22:19 EDT 1998 | Chrys

| Hello: | BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold joints, op

Re: Providing Thermal Relief On Vias/Like A Wagon Wheel??

Electronics Forum | Thu Jun 04 09:25:21 EDT 1998 | Chrys

| | | Hello: | | | BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold jo

X-ray capabilities needed for Xilinix 1152-ball BGA

Electronics Forum | Thu Feb 03 13:23:30 EST 2005 | caldon

Hi Steve- We have a Glenbrook system and are pretty pleased with it....as far a value vs. cost it works great. I did have an issue with a Soic with a ground plane in the center...yes SOIC!!! The Ground plane was a heat sync that had vias for thermal

Re: Providing Thermal Relief On Vias

Electronics Forum | Thu Jun 04 08:32:21 EDT 1998 | Dave F

| | Hello: | | BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold joints

Re: Providing Thermal Relief On Vias

Electronics Forum | Wed Jun 03 21:25:33 EDT 1998 | John Allan

| Hello: | BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold joints, op

Thermal Pads Soldering Worry, can anybody help?

Electronics Forum | Thu Jul 20 23:41:55 EDT 2017 | heros_electronics

Below is an email that I copy and pasted from my customer's engineer about his concerns with the issue of the chips not reflowing (which is why I was asking about X-ray the chips to make sure they reflowed): Can you let me know your thoughts on his

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