Electronics Forum: via tent busters (Page 4 of 15)

Tented vias on ENIG boards

Electronics Forum | Wed Feb 01 14:31:03 EST 2006 | John S.

http://www.saturnelectronics.com/docs/Getting_the_Lead_Out.pdf This is a document provided by one of our suppliers discussing lead free PCB considerations. Within the document, it mentions black pad being associated with tented vias. Thanks John S.

Tented Via's

Electronics Forum | Thu Feb 21 17:19:08 EST 2008 | davemn

if you are not using them for test points or want them filled with solder for current carrying capability then tent them puppies. i was able to move our company away from exposed vias many years ago and this eliminated lots of hairline shorts between

Tented Via's

Electronics Forum | Thu Feb 21 11:43:09 EST 2008 | dphilbrick

I asume you're not ICT-ing this board and using the vias for test points?

Tented Via's

Electronics Forum | Wed Feb 20 18:05:24 EST 2008 | slthomas

Tented vias have solved problems for me in the past, but never created any. I have heard seemingly pointless discussions about whether or not the EE that designed the board designed it with filled vias in mind (a consideration of current carrying c

BGA Via Plugging

Electronics Forum | Tue Feb 19 11:08:22 EST 2002 | Chris Anglin

Guideline for Tenting Interstitial BGA Vias It is difficult to give a complete recommendation on via tenting without an idea what process conditions are required (ex: wave pass, double reflow, rework etc.). Via Pads (as Test Points) - On Bottom

Tented vias on ENIG boards

Electronics Forum | Mon Feb 06 10:02:14 EST 2006 | Yash Sutariya

Sorry. I actually should clarify those slides. Black pad is not associated with tented vias. Also, you can tent vias with soldermask, but this requires the immersion gold process to be completed prior to soldermask. As such, all copper features (

Tented Via's

Electronics Forum | Thu Feb 21 14:54:36 EST 2008 | shrek

KRIKIES! tenting WILL inhibit solder flow through the top-side me lad. In the meantime, me chap, have you tried to adjust wave parameters? i've read threads here that a vibrating wave will tend to push solder up through holes.

BGA Via Tenting

Electronics Forum | Tue Dec 21 08:03:10 EST 2004 | davef

It's very possible.

BGA Via Tenting

Electronics Forum | Sun Dec 26 21:24:55 EST 2004 | tellinghuisen

Dreamsniper What is the rationale for the double plugging? And why from both sides?

Tented vias on ENIG boards

Electronics Forum | Mon Feb 06 10:39:49 EST 2006 | russ

Thanks Yash!


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