Electronics Forum | Mon Apr 16 12:31:27 EDT 2001 | mparker
If, after all the good advice already given, the engineer insists on following his wacky design, you may still be able to influence some success. First you have the fab house plug the via holes with solder then you make sure that the bottom side of
Electronics Forum | Tue Aug 22 14:52:55 EDT 2000 | John Thorup
Jax - absolutely right - the archives are a valuable tool and deserve to be used more than they seem to be. Caumel - Are your blobs on the solder side or the component side? Are your vias tented on the component side? What size are your vias? Is th
Electronics Forum | Wed Aug 24 21:57:45 EDT 2005 | adeline_ko
The blistering is around the plugging via. I can forward you the pic. For the plugging process, I'm not too sure how they plug. What is the correct practise for the plugging via. Now, what they did is. They will do a tenting process for both side.
Electronics Forum | Tue Mar 07 21:35:16 EST 2006 | Cal Kolokoy
Samir, From experience, the only board test situation where tented via's have difficulty with contact is with a Flying Probe type tester. Otherwise, for traditional ICT, the force of the pogo pins, correct probe type, and fixture design should do th
Electronics Forum | Tue Jun 15 22:31:06 EDT 2010 | Mag10
Depending on the how you plug the via, the void level can significantly affected. If you have via plugged from the bottom side; i.e. opposite side of the component, you will see alot of void due to entrapped air in the via hole. I found work best wh
Electronics Forum | Wed Feb 16 21:51:29 EST 2000 | Dave F
Kurt: Lots of choices, not many of them good, yano. 1 So LPI has taken over the market pretty nearly 100%, but it won't "tent" reliably, because it is not very viscous when applied and drops into the hole. So then, tenting/plugging with LPI is bad
Electronics Forum | Wed Feb 16 21:51:29 EST 2000 | Dave F
Kurt: Lots of choices, not many of them good, yano. 1 So LPI has taken over the market pretty nearly 100%, but it won't "tent" reliably, because it is not very viscous when applied and drops into the hole. So then, tenting/plugging with LPI is bad
Electronics Forum | Mon Feb 21 11:22:21 EST 2000 | K. Ckak
Hi Kurt, I agree with Dave F. I had exact same problem with PBGA placement. We requested our PCB vendor to plug/tent via (button printing) after HASL with SR1000 which worked well in the long run. There are couple of failure modes associated wit
Electronics Forum | Mon Feb 21 11:22:21 EST 2000 | K. Ckak
Hi Kurt, I agree with Dave F. I had exact same problem with PBGA placement. We requested our PCB vendor to plug/tent via (button printing) after HASL with SR1000 which worked well in the long run. There are couple of failure modes associated wit
Electronics Forum | Mon Sep 28 19:07:47 EDT 1998 | Steve Gregory
| I have had some field failures returned recently, the boards had flux contamination under the components in a sensitive area, Nothing really visible until the component was removed, and the board had no evidence of rework of any type. Is it poss
