Electronics Forum | Mon Mar 23 15:41:46 EST 1998 | Stuart Adams
Should I use thermals or direct connects on vias from BGA pads to power planes. The via is connected to the BGA pad via a short 8mil trace.
Electronics Forum | Sat Aug 28 11:03:44 EDT 2004 | mariels
We are currently designing a multi-layer board using a BGA with a pitch of 1mm. Need to find out what hole/pad size via and if they should be plated holes? Thanks
Electronics Forum | Tue Aug 31 15:47:24 EDT 2004 | davef
Choices are: * Via Pad / Drill = 0.020 / 0.010 (Inches) * What ever the IPC land calculator says
Electronics Forum | Tue Mar 24 13:21:16 EST 1998 | Earl Moon
| Should I use thermals or direct connects on | vias from BGA pads to power planes. The via is | connected to the BGA pad via a short 8mil trace. Thermals are safest. However, I have had no problems using direct connects provided parameters are capab
Electronics Forum | Mon Feb 06 10:02:14 EST 2006 | Yash Sutariya
Sorry. I actually should clarify those slides. Black pad is not associated with tented vias. Also, you can tent vias with soldermask, but this requires the immersion gold process to be completed prior to soldermask. As such, all copper features (
Electronics Forum | Tue Jan 31 15:44:08 EST 2006 | John S.
We're looking at lead free surface finishes for some of our products. On one supplier's site, I found a note that tenting vias on ENIG boards can lead to the black pad phenomenon. How does this compare to your design guidelines and experience? Than
Electronics Forum | Wed Feb 01 14:31:03 EST 2006 | John S.
http://www.saturnelectronics.com/docs/Getting_the_Lead_Out.pdf This is a document provided by one of our suppliers discussing lead free PCB considerations. Within the document, it mentions black pad being associated with tented vias. Thanks John S.
Electronics Forum | Tue Jan 31 15:52:39 EST 2006 | russ
I have never related Solder mask layout to Black Pad. I don't see how they could be related but.......
Electronics Forum | Wed Feb 01 16:04:10 EST 2006 | russ
Yes it does doesn't it! I wonder how this can cause black pad. Can you contact Saturn and ask them specifically? I browsed other PCB MFGrs. for this type of info and cannot find anyone else who claims this.
Electronics Forum | Wed Feb 01 18:11:43 EST 2006 | Chris
I wonder if they are concerned about getting chemicals trapped in the tented vias. If the tented vias have pin hole openings or even larger openings, chemicals from the ENIG process could become entrapped in the via holes and not washed away in the
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