Electronics Forum | Tue Oct 05 10:48:46 EDT 1999 | Frank Fossett
I am a new employee at a company that has had a large turnover of employees over the past year. I am working on a board (components on one side only), the engineer (he is also new ) wants to use an .035 pad with a .021 dia. hole, there are no via's u
Electronics Forum | Tue Oct 05 10:13:48 EDT 1999 | Frank Fossett
I am a new employee at a company that has had a large turnover of employees over the past year. I am working on a board (components on one side only), the engineer wants to use an .035 pad with a .012 dia. hole, there are no via's under the zero clea
Electronics Forum | Wed Jun 10 15:10:55 EDT 1998 | Rich
I am looking for the Industry standards on vias. Are they required to be plated with solder or is copper plating enough? What about reliabilty with either one? Also, if tenting the via is required should it be copper plated or solder plated over c
Electronics Forum | Fri Dec 13 12:10:36 EST 2002 | STEPHEN WALTERS
WE ARE EXPERENCING OPEN 8 MILL VIAS UNDER THE BGA'S, THEY ARE OPENING AFTER THE ASSEMBLY PROCESS, THEY ARE FROM MULTIPLE PCB VENDORS, THEY PASS AT THE PCB SUPPLIERS TESTING, AND WE HAVE FOUND THAT THEY HAVE HAD 2 MAJOR CAUSES 1. BUBBLE INTRAPMENT, 2.
Electronics Forum | Wed May 22 19:47:30 EDT 2013 | anvil1021
Also, I was just thinking that most of the large companies we work with do not consider via drain an actual void. As a matter of fact our high dollar super fantastic Xray system actually has a switch to turn off the vias during void detection so that
Electronics Forum | Thu Jun 04 12:22:12 EDT 1998 | John Allan
| | | Hello: | | | BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold jo
Electronics Forum | Tue Jul 27 16:44:31 EDT 1999 | Earl Moon
| | | Presently protos of micro-bgas (80i/o) pitch .030/.031 | | | 12BGA per assembly | | | | | | The board is a (.062, 4 layers) FR-4 using Dry film | | | Pads .014inch | | | Vias within footprint .020inch | | | Vias to be filled by bottom side(sol
Electronics Forum | Tue Jul 27 17:23:45 EDT 1999 | M.L
| | | | Presently protos of micro-bgas (80i/o) pitch .030/.031 | | | | 12BGA per assembly | | | | | | | | The board is a (.062, 4 layers) FR-4 using Dry film | | | | Pads .014inch | | | | Vias within footprint .020inch | | | | Vias to be filled by b
Electronics Forum | Tue Jun 12 17:12:20 EDT 2018 | paul_bmc
I have an issue on my DEK Galaxy printer. The problem is I need to use the hard PCB stop rather than the sensor stop. The printer use to have Heavy Pallet Rails installed prior to me purchasing the machine. The 3rd party removed the rails and repl
Electronics Forum | Tue Jul 04 16:13:09 EDT 2000 | TOOLMANTIM
HELLO BILL I HAVE SOME QUESTIONS FOR YOU 1:HOW ARE YOU CLEANING YOUR STENCIL 2:ARE YOU SINGLE OR DOUBLE PRINTING. 3:ARE YOU USEING VACUUM FIXTURES OR NOT? HERE ARE SOME OTHER THINGS TO TRY. IF YOU ARE CLEANING YOUR STENCIL OFTEN BECAREFUL OF USEING
