Electronics Forum | Thu Jul 03 07:59:53 EDT 2003 | loz
OK. Point taken, lets keep this simple then, how about just the issue of under cured solder resist? Any body else encountered such issues. Just feedback, 'cause its something that just seems to have been highlighted to me. Thanks.
Electronics Forum | Thu Jul 03 11:32:38 EDT 2003 | dphilbrick
It might be easier to answer what we haven�t seen. In today�s economy everyone is looking for a deal. Just remember "there is no sex in the Champaign Room"
Electronics Forum | Mon Jul 07 23:27:41 EDT 2003 | MA/NY DDave
Hi Sam, I am going to guess that a problem is being caused by processing to effect the inside of the LED package. Send some failed LEDs back to the manufacturer to do a failure analysis. Also ask the manufacturer for info on their SMT processing q
Electronics Forum | Tue Jul 08 20:47:38 EDT 2003 | davef
Sam: If your gold overcoat was pourous, the nickel undercoat would corrode prior to your attempting to solder and you would not be able to solder without an aggressive flux. Since you see solder flow and wetting, it indicates the gold did an adequat
Electronics Forum | Tue Jul 15 12:39:43 EDT 2003 | sam
Thank you Russ for your comment. This failure cause should have been confirmed as contaminated plating surface causing poor solderability and conductivity, according to all the testing and observations. The only question remaining to me is that why
Electronics Forum | Wed Jul 16 21:48:43 EDT 2003 | sam
Dave, I believed you are really experienced in SMT soldering process. What I meant good connection, should really be "Visual check by naked eye OK". From your message, there are situation of "marginal solderability" that will lead to uncertainty
Electronics Forum | Tue Jul 08 18:37:54 EDT 2003 | MA/NY DDave
Hi AlC, Q: Who calculates Cp, Cpk. It depends on the company, it's size and structure. Some expect the SMT / Process Engineer to do this work and others have all kinds of other groups involved. YiEngr, MA/NY DDave
Electronics Forum | Mon Jul 07 08:35:13 EDT 2003 | Reman01
Trying to come up with a way to repair or replace damaged or missing balls on BGA's. Has anyone done or tried to do this?
Electronics Forum | Thu Jul 10 02:49:34 EDT 2003 | emeto
Hi! One technique: 1. Remove all balls 2.Make a mask(stensil)for reballing.The holes of the mask must be 0.8-0.9 the size of the pads. 3. Reball chips 4. Reflow chips Good luck
Electronics Forum | Tue Jul 08 07:01:40 EDT 2003 | davef
Try: * ANSI/J-STD-004 - Requirements for Soldering Fluxes * ANSI/J-STD-005 - Requirements for Soldering Pastes * ANSI/J-STD-006 - Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering App
