Electronics Forum | Mon Nov 08 12:47:52 EST 2004 | clampron
Good Day Everyone, I have a BGA rework that has some chipped/damaged solder mask that will need to be repaired prior to BGA replacement. I was wondering what materials are being used in the industry for this type of application. Any help would be g
Electronics Forum | Mon Nov 08 13:38:37 EST 2004 | davef
You need to cover the chipped areas with a protectant coating, like epoxy. Look here:http://www.circuittechctr.com/products/115-1322.shtml We have no relationship, nor receive benefit from the company referenced above.
Electronics Forum | Mon Nov 08 18:05:18 EST 2004 | russ
Looks like we have been running the cure a little short (but only by about 44 min). I need to check if elevated temp shortens cure time to 1 min. at 700F! Thanks Dave, much appreciated Russ
Electronics Forum | Mon Nov 08 15:28:54 EST 2004 | davef
If SMTnet posts listing from "Active threads from last 14 days", why are there listings from July still on the Forum?
Electronics Forum | Mon Nov 08 16:42:56 EST 2004 | masters
This is a valid issue that needs to be addressed and resolved. I have so many changes coming to SMTNet, so any input by you, the users @ SMTNet is invaluable. Thanks, -Ryan Lead Programmer SMTNet
Electronics Forum | Tue Nov 09 15:09:50 EST 2004 | Dreamsniper
IPC Class 1, 2 & 3 do not require side fillets. I think this statement is correct. But they define what is acceptable end joint widt and side over hang. regards,
Electronics Forum | Tue Nov 09 12:41:31 EST 2004 | alanhayllar
What thermally conductive glues are available to glue Luxeon Lumiled parts down? Are single part glues without an activator available, suitable for screen printing or dispensing? Many thanks
Electronics Forum | Wed Nov 10 04:51:15 EST 2004 | alanhayllar
That's great - thanks for the advice on the epoxy's. Can anyone provide any info on the single part thermally conductive adhesives or fillers that do not require an activator? Mant thanks.
Electronics Forum | Wed Nov 10 08:11:01 EST 2004 | davef
This is similar to a recent thread on SMTnet. Look here: http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=30998
Electronics Forum | Wed Nov 10 02:13:32 EST 2004 | Grant
Hi, We are thinking about starting to use via in Pad, for both BGA and 0402 and 0201 components. Does anyone know how this would effect production. Obviously PCB production is not difficult, but this should only effect production and assembly. R
