Electronics Forum | Mon Mar 08 11:42:05 EST 2004 | Jay
Sn-Ag, Sn-Sb, and Sn-Cu based lead free alloys have a higher melting point than that of Sn-Pb eutectic system. Thus, it will be better if you can use a higher TG PCB for lead free purpose. But, also most of commercial products including SAC can be
Electronics Forum | Fri Feb 27 15:20:44 EST 2004 | pdeuel
I have 6 base units of the Metcal PHAP-01 Hot air pencil. I do not have any handles or accessories for these bases. Metcal tells me that these units are obseleted and have been replaced with newer units that have a diferent conector. Is there out th
Electronics Forum | Sat Feb 28 08:15:50 EST 2004 | davef
J-STD-001 has what you need. 3.6 Facilities ......................... 4 3.6.1 Environmental Controls ........... 4 3.6.2 Temperature and Humidity ......... 4 3.6.3 Lighting ......................... 4 3.6.4 Field Assembly Operations ........ 4 3.6.5
Electronics Forum | Mon Mar 01 07:56:25 EST 2004 | mskler
Dear Mr.Bery, You do not mention clearly that you already have that SMT eqipments or you have to set a new line.If you are going to install a new line then you can contact by e-mail.According to the line capacity & the floor can be prepai
Electronics Forum | Sun Feb 29 23:45:19 EST 2004 | Vincent Truong
Hi everyone. I'm in my last semester of my SMT manufacturing 3 year diploma program. I'll graduate in April 2004. I would like to go further study of this field. I'm planning to get the SMT engineering degree, can someone give me a direction what u
Electronics Forum | Mon Mar 01 13:06:55 EST 2004 | Chris
Hi I have a question about fiducial mark. Can anyone explain me how it is work?. Do you have to during programming set exactly center of the mark? or approximate point the mark and the machine during placemnt will correct it. In some P&P i have met
Electronics Forum | Tue Mar 02 10:24:06 EST 2004 | russ
I have done this before, We print with a 5-6mil stencil and have had no problems with any underneath solder. If you are still nervous instead of removing from stencil use some 3 mil kapton tape or equivelant and tape off the BGA pads. This way the
Electronics Forum | Thu Mar 04 20:15:51 EST 2004 | davef
Print paste in the holes you don't plan to use and let it dry. That way you don't affect your paste volume in other apertures. The bad news: When you don't want paste to dry and close your apertures, it will do it. When you want paste to dry and
Electronics Forum | Tue Mar 02 11:06:14 EST 2004 | Morris
I'm wondering what others are doing with splicing SMT carrier tapes when necessary. (e.g to join cut tapes etc) The system we have seems kind of clumsy and when a tape is spliced, often causes jams in the feeder anyway. Any systems or advice you can
Electronics Forum | Wed Mar 03 13:50:37 EST 2004 | gregp
The root cause of your problem is your placement equipment. It is not designed for continuous production during component replenishment. Feeders that can be removed, reloaded, and placed back on the machine while the machine is running (without mis
