Electronics Forum: viewed (Page 4707 of 7902)

Gluing Quality Issue !!!

Electronics Forum | Wed Nov 04 03:33:04 EST 2009 | valeo

Hi Davef, I have already checked the SMTnet archives but unfortunetly I didn't find answers regarding mechanical behviour specifications of component glued on substrat. This king of soldering process is new for us. For example, the specification f

Gluing Quality Issue !!!

Electronics Forum | Thu Nov 12 12:05:06 EST 2009 | valeo

Up! Thanks anyway for your answer Lynn. But I'm still in the issue regarding the assembly of passive components on substrat with conductive adhesive. We hardly reach the minimum specifications of shear strengh for each component we use (1206, 0805

Gluing Quality Issue !!!

Electronics Forum | Fri Nov 13 04:45:30 EST 2009 | lococost

Hi dave, Sorry to hi-jack the tread a bit, but,we are experiencing some problems with components falling off somewhere in our factory, you made me think about printer settings being an issue. By print print, do you mean a double sweep of the squeeg

suggest whether we can place BGA without Bals on PCB after Print

Electronics Forum | Wed Nov 04 17:18:30 EST 2009 | davef

It will be very difficult to apply the proper amount of solder with a stencil to bump a ball that is the proper size. A low volume ball is less reliable than a customary sized ball. There are: * Reballing service providers * Reballing preforms * For

suggest whether we can place BGA without Bals on PCB after Print

Electronics Forum | Thu Nov 05 13:00:27 EST 2009 | swag

The solder joints might hook up but my opinion is you'll end up with mechanically weak joints that could fail over time. If your trying to get your Xbox back on-line at home I'd try it but not if your charging $ to fix it for someone else or re-work

PLCC LED placement issues

Electronics Forum | Wed Nov 04 10:31:25 EST 2009 | vetteboy86

I'm not familiar with a puff off setting. I have tried some different things including release delay to shut the vacuum off before the nozzle lifts in the upward direction. I tried to minimally overstroke the part hoping the paste tension would over

PLCC LED placement issues

Electronics Forum | Wed Nov 04 21:18:23 EST 2009 | isd_jwendell

I only have first-hand experience with 2 pick-n-place machines, but both used a small pressure puff to insure part release. I haven't seen any software settings for this, but a small solenoid valve was dedicated to the operation. I recommend you look

PLCC LED placement issues

Electronics Forum | Thu Nov 05 16:38:45 EST 2009 | rdoss

I don't recall where the puff off setting is either, but i know there is one. Find it and use that along with extending your pressing time. This will increase the time in which the nozzle holds the component in the solder. That, along with the puf

Orbotech VT 9300 HD (Need Help)

Electronics Forum | Wed Nov 04 20:24:02 EST 2009 | szaidi

Orbotech VT 9300 HD We are looking for someone who can give us training or help us for setup Orbotech VT 9300 HD. We bought used machine and need help for installation and running the machine. we are willing to pay sent me email streamlineem@gmai

SMT OEE Calculator

Electronics Forum | Sun Nov 08 10:41:11 EST 2009 | rao

Excellent Web OEE calculator... For Ideal Cycle time we use to take Programming Cycle Time but in this calculator it seems you have taken Equipment Rated CPH. For a Given Board & the placement locations the rated CPH is not at all attainable because


viewed searches for Companies, Equipment, Machines, Suppliers & Information

Sell Used SMT & Test Equipment

High Throughput Reflow Oven
Selective soldering solutions with Jade soldering machine

High Precision Fluid Dispensers
Best SMT Reflow Oven

World's Best Reflow Oven Customizable for Unique Applications